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演讲人

Lecturer

IP与IC设计服务（一）

IP and IC Design Service (I)

主持人：余成斌，中国半导体行业协会集成电路设计分会副理事长

Moderator: Seng-Pan (Ben) U, Vice General Director, CSIA-ICCAD

08:40-09:00

国产高性能接口IP的进展和量产解决方案

Progress of Domestic High-performance Interface IP and Mass Production Solutions

高专，芯动科技有限公司VP/技术总监

Zachary Gao, VP/Technical Director, INNOSILICON Technology Ltd.

09:00-09:20

专注打造精品IP，以匠心成就客户

Devoting to High-quality IP and Achieving Customer Success with Superb Technology.

李孟璋，芯耀辉科技有限公司CTO

MC Lee, CTO, Akrostar Technology Co., Ltd.

09:20-09:40

平板电脑高性能应用处理器芯片及软件解决方案

High Performance Application Processor and Software Solution for Tablet Computer

汪志伟，芯原股份高级副总裁、系统平台解决方案事业部总经理

Zhiwei (Wiseway) Wang, SVP, GM of System Platform Solution Division, VeriSilicon

09:40-10:00

智能计算时代的计算架构演进趋势

The Evolution Trend Of The Computing Architecture In The Intelligent Computing Era

KengSu Teoh，安谋科技XPD工程总监

KengSu Teoh, Director of XPD Engineering, Arm China

10:00-10:20

锐成芯微WiFi6射频IP加速新一代物联网芯片崛起

Actt WiFi6 RF IP Accelerates the Development of Next Generation IoT SoC

杨毅，成都锐成芯微科技股份有限公司VP

Yi Yang, VP, Chengdu Analog Circuit Technology Inc.

10:20-10:40

重塑人们出行方式的硅基平台

Reform the Way People Move by Silicon Platform

杨宜，索喜科技（上海）有限公司总经理

Rayman Yang, GM, Socionext Shanghai

10:40-11:00

私有云在IC验证中的应用

Private Cloud in IC Verification

王登宝，上海合见工业软件集团有限公司

Deng bao Wang, UNIVISTA

11:00-11:20

Maximizing SoC Bandwidth using Dynamic Voltage and Frequency Scaling

Andrew Cole, CC Chen, Randy Caplan, Silicon Creations

11:20-11:40

IP国产化的困境与芯思原的破局思考

The Dilemma of IP Localization and VeriSyno’s Thinking

王尚元，芯思原微电子有限公司技术支持经理

Shangyuan Wang, Technical Support Manager, VeriSyno Microelectronics Co., Ltd.

11:40-12:00

国产FPGA赋能ADAS

Domestic FPGA Empowers ADAS

王添平，广东高云半导体科技股份有限公司CTO

TP Wang, CTO, GOWIN SEMICONDUCTOR CORP.

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:10

自助午餐 Buffet Lunch

主持人：徐璐琦，中国半导体行业协会集成电路设计分会副秘书长

Moderator: Luqi Xu, Vice General Secretary, CSIA-ICCAD

13:10-13:30

专业设计服务助力客户成功

Professional Design Services Help Customers Succeed

闫银宝，上海申首半导体科技有限公司副总经理

Rimbo Yan, VP, Shanghai S1semi Technology Co., Ltd.

13:30-13:50

领先图形处理技术赋能数字化生活

Leading Graphics Processing Technology Enables Digital Life

李安，Imagination公司AI及SoC技术专家

Adam Li, Principle Application Engineer, Imagination

13:50-14:10

Secure-IC Integrated Secure Element, 为您的芯片带来信任根并满足多种安全标准

Secure-IC Integrated Secure Element, Brings Root of Trust and Standard Compliance to Your Chip

汪盛楠，Secure-IC 大中华区销售与市场经理

Shengnan Wang, Sales & Marketing Manager of Greater China, Secure-IC

14:10-14:30

新世代芯片互联技术，重新定义系统设计

Next Generation Chip Interconnection Technology Redefines System Design

陈博宇，OpenFive高级销售总监

Alex Chen, Senior Sales Director, OpenFive China

14:30-14:50

IP定制，为IC设计加速助力

IP Customization Accelerates IC Design

罗培君，四川和芯微电子股份有限公司销售经理

Peijun Luo, Sales Manager, IPGoal Microelectronics (Sichuan) Co., Ltd.

14:50-15:10

中科芯蕊-国产超低功耗MCU的创新领导者

Zhongke Xinrui-Innovative Leader of Ultra Low Power MCU

胡晓宇，北京中科芯蕊科技有限公司总经理

Xiaoyu Hu, CEO, Beijing Zhongke Xinrui Technology Co., Ltd.

15:10-15:30

AI赋能IoT行业新的机遇

AI Enables New Opportunities in the IoT Industry

宋一平，CEVA公司OEM BD

Patrick Song, OEM Business Development, CEVA

15:30-15:50

基于RISC-V的嵌入式安全域IP

SECURITY ENCLAVE Based on RISC-V

谢林，SilexInsight大中华区负责人

Tony Xie, Head of Greater China, SilexInsight

15:50-16:10

IC设计中的颠覆 — AI & ML

Disruptions in IC Design – AI & ML

卡蒂克，智权半导体科技（厦门）有限公司总经理

Karthik Gopal, Asia GM, SmartDV Technologies

16:10-16:30

摩尔精英平台化定制芯片设计服务

MooreElite IC Design Service Platform

钟明宇，摩尔精英芯片设计服务技术支持经理

Ryan Zhong, Field Application Manager, IC Design Service, MooreElite

16:30-16:50

通过RISC-V使能的AIoT系统挖掘数字化价值

Capture Value of Digitization via RISC-V Enabled AIoT System

江朝晖，广东跃昉科技有限公司CEO/ CTO

Aglaia Kong, CEO/CTO, GuangDong LeapFive Technology Co., Ltd.

16:50-17:10

电子城ICC：营造集成电路设计“芯”氛围

Creating a New Air of IC Design

兰文丽，北京电子城集成电路设计服务有限公司总经理

Wenli Lan, GM, Beijing Electronics Zone Integrated Circuit Design and Service Co., Ltd.

17:10-17:30

“即插即用”模块加速新型AI 芯片的设计实现

"Plug-n-Play" Modules Accelerate Implementation of New ML/AI ASIC Designs

张爱东，顺卓微电子（西安）有限公司亚太区工程部负责人

Albert Zhang, Regional Head of Engineering APAC, Sondrel (Xi’an) Co., Ltd.

17:30-17:50

高性能运算/人工智能设计和2.5D/3D先进封装

HPC/AI Design and 2.5D/3D Advanced Package

温德鑫，世芯电子上海分公司经理

Daniel Wen, Site Manager of Shanghai, Alchip Technologies

17:50-17:55

幸运抽奖Lucky Draw

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演讲人

Lecturer

IP与IC设计服务（二）

IP and IC Design Service (II)

主持人：李军，中国半导体行业协会集成电路设计分会副秘书长

Moderator: Jun Li, Vice General Secretary, CSIA-ICCAD

08:40-09:00

创意电子2.5D/3D多芯片集成技术方案实现介绍 - 助力AI/HPC/Networking等芯片量产实现

GUC 2.5D and 3D Multi-die Integration Solution

肖有军, 创意电子股份有限公司上海设计中心总监

YJ Xiao, Director, Global Unichip Corporation (GUC)/CIDS

09:00-09:20

今日设计，赋能未来数据：利用芯片遥测技术进行全生命周期性能和可靠性监测

Designing Today for Data Tomorrow: Lifetime Performance & Reliability Monitoring using Chip Telemetry

Roger Lin，proteanTecs大中华区应用工程总监

Roger Lin, Director Application Engineering, Greater China, proteanTecs

09:20-09:40

台积公司设计生态赋能产品创新，共创美好未来

Enabling Product Innovation for a Brighter Future: 2021 Design Ecosystem Update

陈敏，台积电技术支持副总监

Amy Chen, Technical Support Deputy Director, TSMC

09:40-10:00

eNVM技术，让BCD工艺平台如虎添翼

Embedded Non-Volatile Memories Make BCD Platforms More Powerful

王明，成都锐成芯微科技股份有限公司器件研发总监

Samuel Wang, Device Director, Chengdu Analog Circuit Technology Inc.

10:00-10:20

各展所长，合作共造中国芯

Develop Strongpoint to Make a China Core

何俊举，上海佩纶半导体有限公司联合创始人

Jessy He, Co-Founder, peilunsemi

10:20-10:40

赛昉科技赋能高性能RISC-V应用生态发展

StarFive — Empowering the Development of RISC-V High Performance Application Ecosystem

周杰，赛昉科技有限公司销售总监

Jay Zhou, Senior Sales Director, StarFive Technology Co., Ltd.

10:40-11:00

2009-2022年IP-XACT标准的发展演变

IP-XACT’s Evolution from 2009 to 2022

曾品翰，Arteris中国区的技术支持经理

William Tseng, Field Applications Engineer Manager, Arteris IP

11:00-11:20

55nm~14nm自主开发IP及SoC平台加速量产解決方案

Fast Time-to-market — Faraday’s Owned-designed IP & SoC Platform at 55nm~14nm

孔晓彬，智原科技ASIC技术顾问

Bruce Kong, ASIC Technical Consultant, Faraday

11:20-11:40

异构多核：5G和AI时代芯片核心设计技术

Heterogeneous Multi-Core：Key Tech of 5G&AI Era Chip Design

谷建余，无锡华大国奇科技有限公司 CEO

Jianyu Gu, CEO, Qualchip Technologies, Inc.

11:40-12:00

后疫情时代，如何迎接高性能运算、物联网与车用电子芯片的发展

In the Post-epidemic Era, How to Embrace the Development of HPC, IoT and Automotive Electronic Chips

王宏康，芯测科技股份有限公司资深业务经理

Bill Wang, Senior Sales Manager, iSTART -TEK. INC.

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:10

自助午餐 Buffet Lunch

主持人：赵建忠教授，中国半导体行业协会集成电路设计分会副秘书长

Moderator: Prof. Jianzhong Zhao, Vice General Secretary, CSIA-ICCAD

13:10-13:30

安全信任根 – 守护芯片安全

Root of Trust – Secure Your Chip

包乌日吐，深圳市纽创信安科技开发有限公司安全方案顾问

Stanley Bao, Security Solution Consultant, Open Security Research, Inc.

13:30-13:50

国产汽车电子关键技术突破与应用

Breakthrough and Application of Key Technology of Domestic Automotive Electronics

肖佐楠，苏州国芯科技股份有限公司总经理

Joe Xiao, CEO, C*Core Technology Co., Ltd.

13:50-14:10

RISC-V开放架构在“中国芯”进程中的机遇与挑战

The Opportunities and Challenges in Applying RISC-V Architecture to Build the Chinese Self-control Chips

李珏，芯来科技市场及战略VP

Li Jue, Vice President of Strategy and Marketing, Nuclei

14:10-14:30

RISC-V嵌入式处理器架构成为芯标准

RISC-V: A New Industry Standard

程明明，Andes技术服务经理

Albert Cheng, Manager of Technical Service, Andes Technology

14:30-14:50

爱芯元智：AI ISP——人工智能视觉芯片的成像之美

Axera: AI ISP - How to get better video on AIvision chips

张兴，爱芯元智ISP负责人、系统架构师

Xing Zhang, ISP System Architect, Axera

14:50-15:10

西门子旗下EDA产品OneSpin助力实现精确的验证覆盖率指标

Siemens EDA OneSpin：Precise Coverage Metrics Equals Higher Verification Quality

陈维嵬，OneSpin: a Siemens Business中国区技术经理

Wei Wei Chen, Technical Manager for China, OneSpin: a Siemens Business

15:10-15:30

加速处理器核心设计自动化

Design Automation for Accelerating Processor Core Design

相海英，Codasip中国总经理,

Tina Xiang, China GM, Codasip

15:30-15:50

基于RF SOI的NB IoT射频前端

NB IoT Front End based on RF SOI

杨文伟，上海新微技术研发中心有限公司研发总监

Wenwei Yang, R&D Director, Shanghai Industrial uTechnology Research Institute

15:50-16:10

灿芯助力中芯国际先进工艺及生态系统

What can Brite Bring to the SMIC Ecosystem?

赵飞，灿芯半导体（上海）股份有限公司项目管理总监

Timothy Zhao, TSM/PM Director,

Brite Semiconductor (Shanghai) Co., Ltd.

16:10-16:30

打造先进存储芯片的一站式设计服务

Build the Advanced Storage Controller by One-stop Design Service

罗挺，得一微电子股份有限公司市场总监

Roddy Luo, Marketing Director, YEESTOR Microelectronics Co., Ltd.

16:30-16:50

高速连接未来——国产接口IP深耕者

High-speed Connection Future-Domestic IP Interface Deep Tiller

赵喆，牛芯半导体（深圳）有限公司副总经理

Zhe Zhao, Deputy GM, KNIULINK. Co., Ltd.

16:50-17:10

不一样的IP，不一样的ASIC

Specialized IP, and Specialized ASIC

王洪鹏，中茵微电子（南京）有限公司执行董事

Jason Wang, Executive Director, JoinSilicon Microelectronics (Nanjing) Co., Ltd.

17:10-17:30

志翔科技为IC企业构建安全高效的研发环境

ZShield: Secure the Workplace for IC Company

何轶，志翔科技解决方案总监

Yi He, Director of Solution, Zshield Inc.

17:30-17:50

卡姆派乐IDE对RISC-V架构HarmonyOS应用开发的支持与优化

Compiler-dev IDE Support and Optimization for the HormonyOS Application Development on the RISC-V Architecture

王锋，湖南卡姆派乐信息科技有限公司CEO

Feng Wang, CEO, Hunan Compiler Information Technology Co. Ltd.

17:50-17:55

幸运抽奖Lucky Draw

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演讲人

Lecturer

先进封装与测试（一）

Advanced Packaging and Testing (I)

主持人：周荣，中国半导体行业协会集成电路设计分会副秘书长

Moderator: Rong Zhou, Vice General Secretary, CSIA-ICCAD

08:40-09:00

“芯片-封装-系统”协同设计及其价值体现

Unleash the Value with Silicon-Packaging-System Co-Design

杨程，长电科技设计服务事业部先进及系统级封装设计总监

Cheng Yang, Director of Advanced Packaging and SiP Design, Design Service BU, JCET Group

09:00-09:20

一个先进的半导体测试开发流程

An Advanced IC Test Development Flow

赵庆，摩尔精英产品工程副总裁

Qing Zhao, VP of Product Engineering, MooreElite

09:20-09:40

先进封装中关于晶圆划片的几项技术应用

Several Technical Applications of Wafer Dicing in Advanced Packaging

余胡平，沈阳和研科技有限公司副总经理

Huping Yu, GM, Shenyang Heyan Technology Co., Ltd.

09:40-10:00

逆向工程是否能加速中国“芯”的发展

Can Reverse Engineering Accelerate the Development of Chinese Cores?

贾丽娟，上海聚跃检测技术有限公司技术总监

Lisa Jia, Technical Director, Juyue Inspection Technology Co., Ltd.

10:00-10:20

封装集成技术趋势与解决方案

Package Challenges On SiP & FHEC' Solutions

钟磊，甬矽电子（宁波）股份有限公司, 研发总监

Zhong Lei, R&D Director, Forehope Electronic(NING BO) Co. Ltd.

10:20-10:40

车用电子封装趋势与解决方案

Technology Trend & Package Solution for Automotive Application

沈政昌，日月光集团汽车工程处处长

Allen Shen, Director of Automotive Engineering Division, ASE Group

10:40-11:00

高性能环氧塑封料解决方案

High Performance Epoxy Molding Compound Solution

王善学，江苏科化新材料科技有限公司副总经理

Shanxue Wang, Dupty Gerneral Manager, Jiangsu KEHUA New Materials Technology Co., Ltd.

11:00-11:20

基板扇出型封装工艺的应用和挑战

Application and Challenge of Base Plate Fan-out Packaging Process

谭小春，合肥矽迈微电子科技有限公司总经理

Xiaochun Tan, GM, Hefei SMAT Microelectronics Technology Co., Ltd.

11:20-11:40

奈米探针在芯片电性上的应用

The Application of Nano-probe in IC Electric Failure Analysis

陈志荣，蔚思博检测技术（合肥）有限公司工程处协理

Phil Chen, Director, VESP Technology Corp.

11:40-12:00

拥抱新工艺测试挑战，加速中国数“质”变革

Embracing New Test Technology Challenges Speed up China Digital Evolution

于波，泰瑞达(上海)有限公司现场产品专家

Beck Yu, Field Product Specialist,  Teradyne (Shanghai) Co., Ltd.

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:10

自助午餐Buffet Lunch

主持人：徐秀法，中国半导体行业协会集成电路设计分会副秘书长

Moderator: Xiufa Xu, Vice General Secretary, CSIA-ICCAD

13:10-13:30

池州华宇电子探索SiP集成封测解决方案

HISEMI Integration Solutions for SiP Packaging and Testing

彭勇，池州华宇电子科技股份有限公司总经理

Peter Peng, GM, Chizhou HISEMI Electronics Technology Co., Ltd.

13:30-13:50

数据信息时代射频器件封装技术发展

Development of RF Device Packaging Technology in the Era of Data and Information

刘卫东，华天科技技术市场总监

Wade Liu, Technical & Marketing Director, HT-Tech

13:50-14:10

多端口射频前端与变频器件的测试方案

Measurement Solution for FEM and Frequency Converting Devices

荀飞，罗德与施瓦茨矢量网络分析仪产品经理

Ivan Xun, R&S VNA PM, Beijing Rohde & Schwarz Communication Technology Co., Ltd.

14:10-14:30

后摩尔时代关键封装技术分析

Key Package Assembly Technology Analysis for Post - Moore’s Law Era

王鹏，通富微电业务中心技术行销副总 Peng Wang, VP of TPM, TFME

14:30-14:50

数字仿真与工艺结合应用

Combined Application of Digital Simulation and Technology

巫文豪，上海哥瑞利软件有限公司产品中心总监

Wenhao Wu, Product Center Director, Shanghai Glorysoft Co., Ltd.

14:50-15:10

移动时代---超薄集成电路面临的机遇与挑战

Opportunities and Challenges for Ultra-thin Integrated Circuits in the Mobile Era

何忠亮，深圳市鼎华芯泰科技有限公司董事长

He Zhong Liang, Chairman, Shenzhen Ding Waa Sam Tai Technology Co., Ltd.

15:10-15:30

新一代数字SOC测试

Next Generation Digital SOC Test

葛樑，爱德万测试（中国）业务发展高级经理

Liang Ge, Senior Business Development Manager, Advantest China

15:30-15:50

先进失效分析技术在集成电路的应用

Application of Advanced Failure Analysis Skill in Integrated Circuits

陈清珑，苏试宜特检测技术有限公司失效工程处处长

Larry Chen, Division Manager, CHINAiSTI Testing Technology Co., Ltd.

15:50-16:10

得“芯”应手，是德科技高性能芯片测试之道

From Chipset to Cloud, Keysight helps on high performance IC test

阳任平，是德科技中国区IC行业经理

Renping Yang, Greater China IC Industry Manager, Keysight

16:10-16:30

晶圆级扇出封装技术

Wafer Level Fan-out Packaging Technology

吕书臣，江苏中科智芯集成科技有限公司销售市场总监

Shuchen Lv, Sales & Marketing Director, CASMEIT

16:30-16:50

国产高端芯片封测的发展机遇--锐杰微科技的产品与服务介绍

Development Opportunities of Domestic High-end Chip Packaging and Testing-Introduction of Products and Services of RMT

方家恩，锐杰微科技集团董事长

Jiaen Fang, Chairman of the Board, Rigger Micro Technologies

16:50-17:10

ATE测试接口PCB设计与制造所面临的挑战和机会

Challenges and Opportunities in the Design and Manufacture of ATE Test Interface Board

周德祥，天芯互联科技有限公司产品线总监

Russell Zhou, Product Director, Sky Chip Interconnect Technology Co., Ltd.

17:10-17:30

有机载板在模块化和异构集成发展路线上的重要性

The Importance of Organic Substrates for Modularization and Heterogeneous Integration

贝罗莎，奥特斯（中国）有限公司事业部半导体业务部高级总监

Rozalia Beica, Business Line Semiconductors, AT&S BU MS

17:30-17: 50

先进封测技术在5G产品中的应用

The Application of Advanced Package and Testing Technology in 5G Products

孙拓北，深圳市中兴微电子技术有限公司封测量产部部长

Tuobei Sun, Director, Shenzhen Sanechips Technology Co., Ltd.

17:50-17:55

幸运抽奖Lucky Draw

时  间

Time

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Contents

演讲人

Lecturer

无锡集成电路产业创新发展高峰论坛暨第三届太湖创芯峰会

主持人：王伟伦，无锡市滨湖区人民政府副区长

08:30-09:00

嘉宾签到

09:00-09:15

无锡市人民政府领导致辞

中国半导体行业协会集成电路设计分会理事长致辞

中国电子信息产业发展研究院领导致辞

09:15-09:30

滨湖区集成电路产业介绍推介

09:30-10:30

启动仪式：无锡集成电路产业学院启动仪式

· 签约仪式

1、校地合作签约：

2、院地合作签约：

3、基地合作签约：

4、近期落户产业项目签约：扬杰科技、神州龙芯、惠芯、易矽（蠡园开发区领导与企业代表共同签约）

5、深化产业合作项目签约

10:30-11:00

集成电路设计业代表企业演讲

11:00-11:30

专家高峰圆桌讨论：设计先行 创芯无限

主持人：江苏省半导体行业协会秘书长 秦舒

11:30-11:35

幸运抽奖Lucky Draw

11:35-13:10

自助午餐Buffet Lunch

资本与IC设计业

VC and IC Design Industry

主持人：孙坚，石溪资本管理合伙人、中国半导体行业协会集成电路设计分会副秘书长

Moderator: Jian Sun, Vice General Secretary, CSIA-ICCAD

13:10-13:30

下一波——半导体行业新阶段

Next wave - IC Industry New Era

王林，华登国际合伙人

Wang Lin, Partner of Walden International 

13:30-13:50

助力中国半导体产业2.0时代

Assist China's Semiconductor Industry 2.0

王蓓蓓，中芯聚源股权投资管理（上海）有限公司董事总经理

Beibei Wang, Managing Director, China Fortune-tech Capital Co., Ltd.

13:50-14:10

赋能半导体产品创新

Enabling Semiconductor Product Innovation

胡颖平，元禾璞华董事总经理

Yingping Hu, Managing Director, Hua Capital

14:10-14:30

半导体热潮下中国半导体发展和投资机遇

Semiconductor Development and Investment Opportunities in China under the Semiconductor Upsurge

苏仁宏，湖杉资本创始合伙人

Tony Su, Founding Partner CEO, Allin Capital

14:30-14:50

产投联动，芯创未来一一中关村芯创基金与ICPARK园区的共生实践

Industry-Investment Linkage, Chip Innovation Future, the Symbiotic Practice of ZhongGuanCun XinChuang Fund and ICPARK

许正文，北京中关村集成电路设计园发展有限责任公司执行总经理

ZhengWen Xu, Executive GM, Zhongguancun Intergrated Circuit Design Park

先进封装与测试（二）

Advanced Packaging and Testing (II)

14:50-15:10

多芯片3D合封晶圆级集成封装技术- SmartPoser^TM

SmartPoser^TM for Multi-chip 3DIC Integration

林正忠，盛合晶微半导体（江阴）有限公司VP副总裁

ChengChung Lin, VP, SJ Semiconductor (JiangYin) Corp.

15:10-15:30

车规级电子元器件可靠性解决方案——AECQ

Reliability Solution of Vehicle Specification Level Electronic Components——AECQ

杜润，苏州华碧微科检测技术有限公司技术经理

Mark Du, Technical Manager, Suzhou FALAB Test Technology Co., Ltd.

15:30-15:50

Labless的前世今生——芯片医院与高端制造业变革

Labless - Past Present & Future

李晓旻，胜科纳米（苏州）有限公司总裁/董事长

Xiaomin Li, President and Chairman, Wintech-Nano (Suzhou) Co., Ltd.

15:50-16:10

在WLP/PLP量产型贴片机选择中的重要考虑因素

Important Considerations of Selecting WLP & PLP Die PnP Tool For HVM

张迪，ASM太平洋科技有限公司

Derek Zhang, Business Development Manager, ASM Pacific Technology Ltd.

16:10-16:30

功率器件中UBM层-化学镀的实际运用

Application of Electroless Plating for Power Devices

黄雷，深圳市创智成功科技有限公司总经理

Lei Huang, GM, Shenzhen Chuangzhi Success Technology Co., Ltd.

16:30-16:50

基于TSV工艺的先进封装技术

TSV Based Advanced Packaging Technology

周鸣昊，华进半导体封装先导技术研发中心有限公司市场总监

MingHao Zhou, Marketing Director, National Center for Advanced Packaging Co., Ltd.

16:50-17:10

异构封装在AI 和超级计算中的应用

Heterogeneous IC Packaging for AI and Compute

王明波，安靠科技大中华区销售和市场副总监

Bibby Wang, Deputy Director of Greater China Sales & Marketing,

Amkor Technology, Inc.

17:10-17:30

先进封装缺陷及失效案例解析

Advanced Packaging Defect and Failure Analysis Cases

高峰，闳康技术检测（上海）有限公司

FA工程部门经理

Otis Gao, FA Department Manager,  Materials Analysis Technology (Shanghai) Ltd.

17:30-17: 50

ATE为你实现出色的多媒体音频/视频应用

Enabling Multimedia-Oriented ATE Test System

陈文建, CHROMA中茂电子(上海)有限公司资深销售经理

Wen Chien Chen, Senior Sales Manager, Chroma Electronics (Shanghai) Co., Ltd.

17:50-17:55

幸运抽奖Lucky Draw

时  间

Time

内    容

Contents

演讲人

Lecturer

EDA与IC设计创新

EDA and IC Design Innovation

主持人：沈磊，中国半导体行业协会集成电路设计分会副理事长

Moderator: Lei Shen, Vice General Director, CSIA-ICCAD

08:40-09:00

Cadence面向三维芯片设计规划、实现和系统级仿真的集成化解决方案

Cadence 3D-IC Multi-die Integrated Solution for 3D Design Planning, Implementation and System Level Analysis

邓立群，Cadence数字集成电路自动化设计研发中心产品工程总监

Richie Deng, Product Engineering Director of Digital & Signoff Group, Cadence

09:00-09:20

西门子EDA如何协助开发智能汽车芯片

Siemens EDA Solutions for Smart Vehicle IC Design

李立基，西门子EDA亚太区技术总监

Lincoln Lee, Technical Director, PacRim, Siemens EDA

09:20-09:40

数字异构验证助力先进节点集成电路设计

Benefits of Heterogeneous Verification

陈正坚，上海国微思尔芯技术股份有限公司资深技术市场总监

Ken Chen, Senior Director of Technical Marketing Department

09:40-10:00

汽车功能安全性

Automotive Functional Safety

周磊，新思科技汽车电子功能安全性验证资深AE工程师

Lane.Zhou, Automotive Functional Safety Staff AE, Synopsys

10:00-10:20

打造模拟芯片设计制造协同发展生态

Constructing the Design-Technology Ecosystem for Analog Circuit Development

刘晓明，华大九天产品总监

Liu Xiaoming, Product Director, Empyrean Technology Co., Ltd.

10:20-10:40

蓄力向前，打造面向存储的全流程EDA

Landing DTCO to Accelerate Memory EDA Solutions

李严峰，上海概伦电子股份有限公司执行副总裁

Yanfeng Li, EVP, Primarius Technologies Co., Ltd.

10:40-11:00

打通数字验证全流程，引领新一代EDA (draft)

Breakthrough Digital Verification Solution for Next Generation of EDA(draft)

黄武，芯华章科技产品市场总监

David Hwang, Product Marketing Director, X-EPIC

11:00-11:20

EDA 上云——加速中国“芯”时代

Accelerate Cloud Transformation - EDA on Azure

孙海亮，微软行业解决方案部总经理

Heidi Sun, Industry Solution Director, Microsoft

11:20-11:40

2.5D/3D 异构集成跨尺度联合仿真解决方案

2.5D/3D Heterogeneous Integrated Cross-Scale Co-Simulation

苏周祥，芯和半导体高级技术支持总监

Zachary Su, AE Director, Xpeedic Technology

11:40-12:00

汽车芯片多物理场电源完整性可靠性分析

Multiphysics Power Noise and Reliability Signoff for Automotive Applications

崔硕岳，Ansys公司半导体事业部技术经理

Shuoyue Cui, Manager Application Engineering, Ansys

12:00-12:05

幸运抽奖 Lucky Draw

12:05-13:10

自助午餐Buffet Lunch

主持人：刘娜，中国半导体行业协会集成电路设计分会副秘书长

Moderator: Na Liu, Vice General Secretary, CSIA-ICCAD

13:10-13:30

面向大规模SoC验证的EDA IaaS解决方案

An EDA IaaS Solution to Face SoC Verification Challenges

马超，英诺达（成都）电子科技有限公司市场及业务拓展部副总裁

Chao Ma, VP of MBD, EnnoCAD Electronic Technology Co., Ltd.

13:30-13:50

业界独特的版图寄生参数分析工具Viso

Viso: An Unique Parasitic Exploration Tool for Layout Design

刘客，Silvaco中国AE经理

Ke Liu, AE Manager, Silvaco China., Ltd.

13:50-14:10

下一代EDA技术

Next generation technology of EDA

陈岚，中科芯云微电子科技有限公司董事长

Lan Chen, Chairman, Chip Cloud Microelectronics Technology Co., Ltd.

14:10-14:30

与芯同行，行芯Signoff工具链加速先进工艺设计收敛

Follow with IC Design, Phlexing EDA Tools Accelerate Signoff Closure at Advanced Nodes

贺青，杭州行芯科技有限公司CEO

Qing He, CEO, Hangzhou Phlexing Technology Co., Ltd.

14:30-14:50

云端半导体协同创新

Semiconductor Collaborative Innovation on Cloud

周宇，亚马逊云科技高科技行业拓展总监

Kevin Zhou, Director of Industry Business Development, High-Tech., Amazon Web Services

14:50-15:10

大规模集成光电子设计关键技术

Key Technologies for Large-scale Photonic Integrated Circuits (PICs) Design

郭进，联合微电子中心（CUMEC）副总经理

Jin Guo, VP, United Microelectronics Center

15:10-15:30

EDA弹性云计算方案

EDA Elastic Calculation on Cloud

王汉杰，摩尔精英IT/CAD设计平台服务副总裁

Johnny Wang, VP of IT/CAD Design Platform Service, MooreElite

15:30-15:50

集成电路设计工艺协同优化完整方案：流程、EDA软件、自动化

A Holistic Approach to DTCO: work flow, EDA tools, and automation

伍宏，墨研计算科学（南京）有限公司总经理

Hong Wu, CEO, Moyan Computational Science (Nanjing) Co., Ltd.

15:50-16:10

智能数据+平台帮助芯片设计企业精准触达目标用户，助力国产替代

Intelligent Data + Platform Helps Chip Design Enterprises Accurately Reach Target Users and Help Domestic Alternatives

王新，Supplyframe四方维市场总监

Shane Wang, Marketing Director, Suppyframe

16:10-16:30

智能云加速IC设计

Intelligent Cloud Accelerates IC Design

邓世友，紫光云技术有限公司 CTO办公室主任

Shiyou Deng, Director UniCloud CTO Office, UNICLOUD TECH CO., LTD

16:30-16:50

Altair高性能计算驱动EDA流程优化高速提效

Altair High-performance Computing Drives EDA Process to High Speed Optimize and Efficiency

王轶华，Altair企业计算部技术经理

Yihua Wang, Enterprise Computing Technical Manager, Altair

16:50-17:10

IC设计企业如何系统性大幅提升研发效率——面向EDA行业应用的一站式IC设计研发云平台

How Could IC Design Companies Significantly Improve R&D Efficiency Systematically-a One-Stop IC Design R&D Cloud Platform

陈琳涛，上海速石信息科技有限公司高级技术总监

Leo Chen, Senior Director, Shanghai FASTONE Information Technology Co., Ltd.

17:10-17:30

IoT时代的超低功耗蓝牙模块设计

The Discussion of an Ultra-low Power BLE5 Module for IoT Application

冯琪，苏州芯联成软件有限公司电路工程处经理

Qi Feng, Head of IC Analysis Department, Suzhou Silintech Company

17:30-17:50

良率驱动的芯片制造全流程解决方案

Yield Driven Chip Manufacturability Solutions

俞宗强，东方晶源微电子科技（北京）有限公司董事长及联合创始人

Zongchang Yu, Chairman of the Board, and Co-founder, Dongfang Jingyuan Electron Limited

17:50-17:55

幸运抽奖Lucky Draw

时  间

Time

内    容

Contents

演讲人

Lecturer

FOUNDRY与工艺技术

Foundry and Process Technology

主持人：张力天，中国半导体行业协会集成电路设计分会副理事长

Moderator: Litian Zhang, Vice General Director, CSIA-ICCAD

08:40-09:00

TSMC 的先进逻辑工艺和3D 集成技术

TSMC’s Leadership in Advanced Logic and 3D Integration Technology

蔡玥，台积电中国区业务发展副总监

Amy Cai, China Business Development Deputy Director, TSMC

09:00-09:20

联电先进特色工艺

UMC Advanced Specialty Technologies

陈剑波，和舰芯片制造（苏州）股份有限公司销售经理

Snowwolf Chen, Sales Manager, HeJian Technology (Suzhou) Co., Ltd.

09:20-09:40

先进特色工艺智联未来

Advanced Specialty Technologies Shape the Future

田明，上海华力微电子有限公司研发总监

Ming Tian, Senior Director of TD, HLMC

09:40-10:00

从电子到光子

From Electron to Photon

朱宇，格芯中国区业务发展总监

Fisher Zhu, Director of China Business Development, GlobalFoundries

10:00-10:20

深耕特色工艺，打造“晶圆+”模式

Deeply Develop Characteristic Technology, to Create Foundry Plus Mode

王霄，华润微电子代工事业群市场与销售中心高级总监

Xiao Wang, Senior Director of Marketing & Sales Center,

Foundry Business Group, CR Micro

10:20-10:40

3D传感感知世界

3D Imager Sensing the World

方大晟，Tower Semiconductor中国区销售总监

Dasheng, China Sales Director, Tower Semiconductor Ltd.

10:40-11:00

国产IP助力以数据为中心的计算架构创新

Domestic IPs Power Data-centric Computing Architecture Innovation

王晓阳，上海奎芯集成电路设计有限公司副总裁

Sean Wang, VP, MSQUARE Ltd. Shanghai

11:00-11:20

同“芯”共赢，助力汽车电子“芯”生态

Win-win Cooperation on Chips to Help Create Chip Ecosystem of Automotive Electronics

杨继业，上海华虹宏力半导体制造有限公司总监

Jiye Yang, Senior Director, ShangHai Huahong Grace Semiconductor Manufacturing Corporation

11:20-11:40

全球领先研究中心，助力半导体创新

The World’s Leading Research Center Boost Semiconductor Innovation

蔡立达，欧洲微电子研究中心现场应用经理

Lida Cai, FAE Manager, IMEC

11:40-12:00

异构集成解锁芯片潜力

Heterogeneous Integration Stimulates IC Potential

唐伟炜，摩尔精英封装服务副总裁

Sunny Tang, VP of Assembly Services, MooreElite

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:10

自助午餐 Buffet Lunch

IC设计与应用

IC Design & Application

主持人：樊晓华，中国半导体行业协会集成电路设计分会副秘书长

Moderator: Xiaohua Fan, Vice General Director, CSIA-ICCAD

13:10-13:30

R16芯片-5G新征程，工业物联新起点

R16 ready, a new chapter in 5G+IIoT

汪大海，紫光展锐产品规划总监

Alexander Wang, Marketing Director, UNISOC

13:30-13:50

基于NOR Flash技术的人工智能终端推理芯片

A NOR Flash Based Inference IC for Low-Power Edge Devices

吕向东，恒烁半导体（合肥）股份有限公司董事长

Xiangdong Lu, CEO, Zbit Semiconductor, Inc.

13:50-14:10

高性能GPU的应用及架构特点

Applications and Architecture Features of High Performance GPU

付轩，沐曦集成电路（上海）有限公司架构师

Gary Fu, Architect, MetaX Integrated Circuits (Shanghai) Co., Ltd.

14:10-14:30

国家集成电路芯火平台的探索

Exploration of National Xinhuo Innovation Base(Paltform)

吕会军，南京集成电路产业服务中心（ICisC）副总经理

Huijun Lv, Deputy GM, Nanjing IC Industry Service Center Co., Ltd.

14:30-14:50

HC9001第五代PCIe高端存储控制芯片

HC9001 PCIe Gen5 Nand Flash Controller Chip

庄健民，江苏华存电子科技有限公司副总经理

Marco Chuang, VGM, Jiangsu Huacun Electronic Technology Co., Ltd.

14:50-15:10

高性能可重构网络安全芯片

High-performance Reconfigurable Network Adaptor Chip

朱敏，无锡沐创集成电路设计有限公司CEO

Min Zhu, CEO, Wuxi Micro Innovation Integrated Circuit Design Co., Ltd.

15:10-15:30

WTM2101: 存算一体芯片

WTM2101: Computing-in-memory SoC

王绍迪，北京知存科技有限公司CEO

Shaodi Wang, CEO, Beijing Zhicun (WITIN) Technology Co., Ltd.

15:30-15:50

高性能可重构GP-GPU芯片——RPP R8

High performance reconfigurable GP - GPU(RPP R8)

李原，珠海市芯动力科技有限公司CEO

Yuan Li, CEO, Zhuhai Azurengine Technology Co., LTD.

15:50-16:10

蓝牙低功耗（BLE）技术特点及其应用发展趋势

Technical Features and Application Trends in Bluetooth Low Energy (BLE)

张书迁，北京昂瑞微电子技术有限公司市场部高级总监

Shuqian Zhang, Senior Marketing Director, Beijing OnMicro Electronics Co., Ltd.

16:10-16:30

存储核芯拓展新兴领域

The Advanced Memory in New Emerging Marketing

田玥，北京兆易创新科技股份有限公司存储事业部市场经理

Yue Tian, Marketing Manager, GigaDevice Semiconductor (Beijing) InC

16:30-16:50

新数据中心网络中的芯方案

Chip Solution in New Data Center Network

陈永洲，烽火通信科技股份有限公司 技术专家

Yongzhou Chen, Technician, FiberHome Telecommunication Technologies, Co., Ltd.

16:50-17:10

方寸用芯片构建网络空间安全基石

TIH Building the Cornerstone of Cyberspace Security with Chip

叶智辉，山东方寸微电子科技有限公司执行副总裁

Jason Ye, EVP, TIH Microelectronics Co., Ltd.

17:10-17:30

高性能自动驾驶芯片赋能汽车智能化转型

High-performance AD Chip Enabling Intelligent Transformation of Automobile

王治中，黑芝麻智能科技产品市场总监

Daniel Wang, Product Marketing Director, Black Sesame Technologies (Shanghai) Co., Ltd.

17:30-17:50

AI计算：从物理感知到知识聚合

AI Computing: From Physical Perception to Knowledge Consolidation

徐宁仪，上海阵量智能科技有限公司CEO

Michael Xu, CEO, ShangHai PowerTensors Intelligent Technology Co., Ltd.

17:50-17:55

幸运抽奖Lucky Draw