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开 幕 式

Opening Ceremony

主持人：厦门市领导

Moderator:

08:40-09:00

中国半导体行业协会领导致辞

工业和信息化部领导致辞

厦门市领导致辞

Address, Leader

高峰论坛

Top Forum

主持人：程晋格，中国半导体行业协会集成电路设计分会秘书长

Moderator: Jinge Cheng, General Secretary, CSIA-ICCAD

09:00-09:30

以持续创新赢得美好未来

— 魏少军教授，中国半导体行业协会集成电路设计分会理事长

Winning the Future via Consistent Innovation

- Prof. Shaojun Wei, General Director, CSIA-ICCAD

09:30-09:50

厦门市集成电路产业推介

— 厦门市局领导（拟）

Introduction to the Integrated Circuit Industry of Xiamen

- Leader of Xiamen Government

09:50-10:10

联动设计与制造，共建EDA生态

— 刘志宏博士，上海概伦电子股份有限公司董事长

Connect Design and Manufacturing to Co-construct the EDA Ecosystem

- Dr. Zhihong Liu, Chairman, Primarius Technology Co., Ltd.

10:10-10:30

中国智慧出行产业的机遇和挑战

— 戴伟民，芯原股份创始人、董事长兼总裁

Opportunities and Challenges of Smart Automotive Industry in China

- Wayne Dai, Chairman, President and CEO, VeriSilicon

10:30-10:50

高性能融合计算IP平台，赋能智能汽车芯片创新

— 刘澍，安谋科技产品研发负责人

High-performance Integrated Computing IP Platform Enables Smart Car Chips Innovation

- William Liu, Head of Product Development, Arm China

10:50-11:10

全方位异质整合封装解决方案

— 王愉博，矽品研发中心副总经理

Comprehensive Heterogenous Integration Package Solutions

- Yu-Po Wang, VP of Corporate R&D Center, SPIL

11:10-11:30

国家“芯火”平台（南京）的思考与实践

— 时龙兴，东南大学首席教授，南京集成电路产业服务中心(ICisC)主任，南京集成电路培训基地（NICT）主任

Thought and Practice of Nanjing National Xinhuo Innovation Base (Platform)

- Longxing Shi, Chief Professor of Southeast University, Director of Nanjing Integrated Circuit Industry Service Center (ICisC), Director of Nanjing IC Training Base（NICT）

11:30-11:50

加速创芯，智领未来

— 凌琳，西门子EDA全球副总裁、中国区总经理

Engineering a Smart Future Faster

— Pete Ling, Vice President, China Country Manager, Siemens EDA

11:50-12:10

全球半导体展望

— 罗镇球，台积电(中国) 总经理

Global Semiconductor Outlook

- Roger Luo, President, TSMC China

12:10-13:20

自助午餐 Buffet Lunch

主持人：余成斌，中国半导体行业协会集成电路设计分会副理事长

Moderator: Seng-Pan (Ben) U, Vice General Director, CSIA-ICCAD

13:15-13:20

幸运抽奖 Lucky Draw

13:20-13:40

强化芯片供应结构，加速迎向纯电车时代

— 林伟圣，和舰芯片制造（苏州）股份有限公司销售副总经理

Structural Readiness For EV Era

- W S Lin, Sales VP, HeJian Technology (Suzhou) Co., Ltd.

13:40-14:00

整机企业呼唤更强大的设计公司

— 彭进，中芯国际集成电路制造有限公司资深副总裁

System Companies Embrace Strong Design Companies

- John Peng , SVP , Semiconductor Manufacturing International Corporation

14:00-14:20

以需求为牵引，推进EDA研发创新

— 郭继旺，北京华大九天科技股份有限公司副总经理

Driven by Demands, We Promote the R&D and Innovation of EDA

- Jiwang Guo, VP, Empyrean Technology Co., Ltd.

14:20-14:40

摩尔精英助力客户芯片高效研发（从0-1）到量产（从1-100万）

— 张竞扬，摩尔精英董事长兼CEO

MooreElite Powers Fabless from Chip R&D to Mass Production

- JY Zhang, Chairman & CEO, MooreElite

14:40-15:00

数智化和低碳化，未来创芯双引擎

— 朱勇，新思科技中国区副总经理

Digitalization and Low Carbon, Twin Engines for Future Innovation

- Yong Zhu, Deputy General Manager, Synopsys China

15:00-15:20

但尽己力，成就未来

— 耿晓杰，Cadence亚太暨日本区总裁技术助理

Lighten Your System with Cadence Intelligence

- George Geng, Technical Assistant to Cadence APAC & Japan President, Cadence

15:20-15:35

茶歇，交流，抽奖Coffee Break, Lucky Draw

15:35-15:55

RISC-V CPU IP 平台，助力国产创芯

—        彭剑英博士，芯来科技CEO

RISC-V CPU IP Platform, Catalyzing Domestic Chip Innovation

Dr. Jianying Peng, CEO, Nuclei System Techonology Co., Ltd.

15:55-16:15

Tower Semiconductor ：模拟与价值相遇

— 秦磊，Tower Semiconductor全球副总裁

Tower Semiconductor – Where Analog and Value Meet

- Lei Qin, VP of China Operations, Tower Semiconductor Ltd.

16:15-16:35

过去、现在与未来——国产数字EDA的破局之路

— 林俊雄，思尔芯董事长及首席执行官CEO

The Development Path of Domestic Digital EDA: Past, Present, and Future

- Toshio Nakama，Chairman & CEO，S2C

16:35-16:55

新模式以及‘更好的’常态

— 王光伟，格芯副总裁兼中国区总裁

The New Model and a “Better” Normal

- Gary Wang, VP, China Country President, GlobalFoundries China

16:55-17:15

开放创”芯”，共赢未来

— 邵华，上海华力微电子有限公司研发副总裁

Open and Innovative Chip Manufacturing Will Achieve a Win-Win Future

— Chris Shao, VP of Technology Development Division, HLMC

17:15-17:35

IP助力中国芯迎来破局时刻

— 曾克强，芯耀辉科技有限公司董事长

Chip IP Helps China’s Chips Reach Breakthrough

- Jack Zeng, Chairman, AkroStar Technology Co., Ltd.

17:35-17:55

数字IC低功耗设计所面临的挑战及应对方案

— 王琦博士，英诺达（成都）电子科技有限公司创始人、董事长

Low Power Design Trends and Opportunities

— Dr. Qi Wang, Founder & GM, Ennocad (Chengdu) Electronics Technology Co., Ltd.

17:55-18:00

幸运抽奖 Lucky Draw

18:00-18:30

观展与交流 Visiting Exhibition

18:30-20:30

欢迎晚宴（概伦电子赞助）

Welcome Dinner Banquet (Sponsored by Primarius)

地点：厦门国际会展中心一楼C4馆

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演讲人

Lecturer

IP与IC设计服务（一）

IP and IC Design Service (I)

主持人：周生明，中国半导体行业协会集成电路设计分会副理事长

Moderator: Shengming Zhou, Vice General Director, CSIA-ICCAD

08:40-09:00

先进工艺下国产高端IP的突破和芯片定制量产

High Performance Interface IP and Custom ASIC Mass Production

高专，芯动科技有限公司VP/技术总监

Zachary Gao, VP/Technical Director, INNOSILICON Technology Ltd.

09:00-09:20

在系统级实现产品创新

Enabling Product Innovations at System Level

陈敏，台积电技术支持总监

Amy Chen, Technical Support Director, TSMC

09:20-09:40

芯原AI-ISP技术带来创新的图像增强体验

VeriSilicon AI-ISP Delivers Innovative Image Quality Enhancement

张慧明，芯原微电子（上海）股份有限公司，IP解决方案副总裁

Huiming Zhang, VP, IP Solutions, VeriSilicon Microelectronics (Shanghai) Co., Ltd.

09:40-10:00

双频Wi-Fi6射频IP，赋能Wi-Fi6产业加速创“芯”

Actt Dual Band Wi-Fi6 RFIP Empowers the Wi-Fi6 Industry

杨毅，成都锐成芯微科技股份有限公司副总经理

Yi Yang, VP, Chengdu Analog Circuit Technology Inc.

10:00-10:20

高效能NPU赋能大算力AI计算

High Efficiency NPU Enables Hundreds TOPS Computing

杨磊，安谋科技产品总监

Alvin Yang, Product Director, Arm China

10:20-10:40

提能增效：构建芯片设计服务新解法

IC Design Efficiency Improvement: New Ways to Define Design Service

王龙，摩尔精英资深业务拓展总监

Long Wang, Senior Business Development Director, MooreElite

10:40-11:00

Chiplet完整解决方案

Chiplet Complete Solution

李孟璋，芯耀辉科技有限公司CEO

MC Lee, CEO, Akrostar Technology Co., Ltd.

11:00-11:20

算力需求大、项目协同效率低、IT架构不灵活、CAD保障要求高、总体成本高——IC设计公司如何敏捷应对半导体行业变化？

Hyperscale Demand for Computing Power, Inefficient Project Collaboration, Inflexible IT Architecture, High CAD Requirements and Overall Costs - How Could IC Design Companies Respond to Changes in the Semiconductor Industry with Agility?

陈琳涛，上海速石信息科技有限公司高级技术总监

Leo Chen, Senior Director, Shanghai FASTONE Information Technology Co., Ltd.

11:20-11:40

芯思原探索国产化IP的实践

Practice of VeriSyno in Exploring Localized IP

丛姗姗，芯思原微电子有限公司销售市场副总裁

Shanshan Cong, VP of Sales & Marketing, VeriSyno Microelectronics Co., Ltd.

11:40-12:00

提升HPC和IoT应用的安全性：整合Secure OTP 和 PUF-based 安全解决方案建立可靠的硬件信任根

Establishing a Reliable Hardware Root of Trust with Secure OTP and PUF-based Solutions for HPC and IoT Applications

汪信志，力旺电子销售总监

Eric Wang, Regional Sales Director,  eMemory

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:10

自助午餐 Buffet Lunch

主持人：徐璐琦，中国半导体行业协会集成电路设计分会副秘书长

Moderator: Luqi Xu, Vice General Secretary, CSIA-ICCAD

13:10-13:30

自适应硬件加速 - 国产FPGA的下一个里程碑？

Hardware Accelerate with Adaptive Computing - Next Milestone of Native FPGA Makers?

王添平，广东高云半导体科技股份有限公司CTO

Tianping Wang, CTO, Gowin Semiconductor Corporation

13:30-13:50

GUC 2.5D/3D Chiplets和互连解决方案及发展趋势

GUC’s 2.5D/3D Chiplets, Interconnect Solutions and Trends

肖有军, 创意电子股份有限公司技术总监

YJ Xiao, Director, Global Unichip Corporation (GUC)

13:50-14:10

Chiplet时代，你准备好了么？

Are you Ready for the Chiplet Era?

王洪鹏，中茵微电子（南京）有限公司董事长

Jason Wang, Chairman, JoinSilicon Microelectronics (Nanjing) Co., Ltd.

14:10-14:30

Imagination 全新IMG RTXM-2200实时嵌入式RISC-V CPU

Imagination RTXM2200 RISC-V CPU

李安，Imagination资深技术经理

Adam Lee, Senior Field Applications Engineering Manager, Imagination

14:30-14:50

IP定制的机遇与机会---IPGoal助力芯发展

Chances and Opportunities for IP Customization---IPGoal Helps Chip Development

罗培君，四川和芯微电子股份有限公司销售经理

Peijun Luo, Sales Manager, IPGoal Microelectronics (Sichuan) Co., Ltd.

14:50-15:10

如何看待最近几年中国的半导体行业的发展

How do You View the Development of China's Semiconductor Industry in Recent Years

谭飞鸿，广州思信电子科技有限公司CTO

Tan, Edmongd Fei Hong, CTO, Guangzhou Sytrons Technology Co., Ltd.

15:10-15:30

设计服务如何赋能大型SoC芯片

How Design Services Enable Large SoC Chips

李小俊，上海佩纶半导体有限公司项目经理

Xiaojun Li, Project Manager

Shanghai Peilun Semiconductor Co., Ltd.

15:30-15:50

用于Edge和人工智能加速器的IP子系统和Chiplets

IP Subsystems and Chiplets for Edge and AI Accelerators

辛佳宇，源昉芯片科技(南京)有限公司技术解决方案经理和IP FAE

Jensen Xin, Technical Solution Manager and IP FAE, OpenFive

15:50-16:10

16:10-16:30

打造高性能芯片矩阵，从3D Chiplet开始

Building HPC Matrix with Origin of 3D Chiplet

祝俊东，奇异摩尔（上海）集成电路设计有限公司产品与解决方案副总裁

Jundong Zhu, VP of Product & Solution, Kiwimoore (Shanghai) IC Design Co., Ltd.

16:30-16:50

应用于SSD SOC之高效能与高质量IP解决方案

The High Performance IP Approaches for SSD SOC Application

郑顺发，円星科技股份有限公司副处长

Frank Cheng, Vice Director, M31 Technology Corporation

16:50-17:10

配备完整生命周期管理的Secure-IC Securyzr iSE，助您轻松应对Post-Quantum Cryptography时代

Secure-IC Securyzr iSE with Total Life Cycle Management, Let You Get Ready for Post-Quantum Cryptography Era

汪盛楠，上海安峪科技有限公司总经理

Shengnan Wang, General Manager, Secure-IC China Co., Ltd.

17:10-17:30

使用机器学习监测技术来设计芯片，以符合未来汽车安全的解决方案

Designing the Future of Automotive Safety with ML-driven Chip Telemetry

徐文龙，以色列商博谛安科技股份有限公司应用工程设计总监

Dragon Hsu, AE Director, proteanTecs

17:30-17:35

幸运抽奖Lucky Draw

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Contents

演讲人

Lecturer

IP与IC设计服务（二）

IP and IC Design Service (II)

主持人：李军，中国半导体行业协会集成电路设计分会副秘书长

Moderator: Jun Li, Vice General Secretary, CSIA-ICCAD

08:40-09:00

HBM3和GDDR6为AI/ML提供更高的内存带宽

Memory Bandwidth for AI/ML Races Higher with HBM3 and GDDR6

苏雷，蓝铂世信息技术咨询（上海）有限公司大中华区总经理

Raymond Su, Country Manager of Greater China, Rambus Information Technology Consulting (Shanghai) Co., Ltd.

09:00-09:20

5G算网融合与元宇宙趋势下的芯机遇

Chipset Opportunities in Metaverse and Merging Trend of 5G Network & Computing Power

周晋，南京创芯慧联技术有限公司副总经理

Jin Zhou, VP, Nanjing Innochip Technology Co., Ltd.

09:20-09:40

IP赋能汽车电动化和智能化变革

IP Empowers Vehicle Electrification and Intelligent Transformation

唐睿，奎芯科技市场及战略部副总裁

Rui Tang, Marketing & Strategy VP, M Square

09:40-10:00

基于高压BCD工艺的嵌入式存储IP，助力电机系统的高集成化

Embedded Non-volatile Memory IPs on High-voltage BCD Process Accelerate the Evolution of Motor System’s High Integration

王明，成都锐成芯微科技股份有限公司存储研发总监

Samuel Wang, Device Director, Chengdu Analog Circuit Technology Inc.

10:00-10:20

芯来RISC-V CPU IP SIMD指令实现Nuclei RISC-V CPU IP SIMD Implementation

胡进，芯来科技AE总监

David Hu, AE Director, Nuclei

10:20-10:40

硅后测试验证自动化的最佳实践  

The Practice of Post-Silicon Workflow Automation

何为，上海孤波科技有限公司CEO

Pearl He, CEO, Shanghai Gubo Technologies Co., Ltd.

10:40-11:00

高性能定制化SoC设计-----实现客户描绘的未来

High Performance Customized SoC Design----- Enabling a Future that Customers Can Envision

谢稷，索喜科技（上海）有限公司市场总监

Mike Xie, Marketing Director, Socionext Technology (Shanghai) Co., Ltd.

11:00-11:20

高端定制SoC芯片全流程设计服务

Spec-to-Chip Design and Production Service for Customized Hi-end SoC

罗东，无锡华大国奇科技有限公司研发副总裁

Dong Luo, Engineering VP, Qualchip Technologies, Inc.

11:20-11:40

智原设计与量产服务，协助客户赢得市场先机

Faraday’s Design & Mass-production Service Facilitates Best Time-to-market

孔晓彬，智原科技ASIC销售经理

Bruce Kong, ASIC Sales Manager, Faraday

11:40-12:00

专业设计服务助力客户成功

Professional Design Services Help Customers Succeed

王国良，上海申首半导体科技有限公司CEO

Francis Wang, CEO, Shanghai S1semi Technology Co., Ltd.

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:10

自助午餐 Buffet Lunch

主持人：赵建忠，中国半导体行业协会集成电路设计分会副秘书长

Moderator: Jianzhong Zhao, Vice General Secretary, CSIA-ICCAD

13:10-13:30

中科亿海微特种FPGA在石油钻探行业的应用

Application of the Ehiway Special FPGA in Petroleum Drilling Industry

潘勇，北京亿海微电子科技（苏州）有限公司应用开发中心总监

Yong Pan, Director of Application Development Center, Ehiway Microelectronic Science and Technology (Suzhou) Co., Ltd.

13:30-13:50

如何为智能网联汽车芯片的信息安全保驾护航

How to Protect the Cybersecurity of Intelligent Connected Automobile Chips?

马博，上海纽创信达科技开发有限公司（纽创信安全资子公司）总经理

Bo Ma, GM, Shanghai Neutral Sender Technology (OSR Wholly-owned Subsidiary)

13:50-14:10

IP和代工——芯片定制服务的双擎动力

IP & Foundry - Dual Engine Power of SoC Customized Service

李想，灿芯半导体（上海）股份有限公司项目管理总监

Marshall Li, PM Director, Brite Semiconductor (Shanghai) Co., Ltd.

14:10-14:30

国产汽车电子关键技术突破与应用

Breakthrough and Application of Key Technology of Domestic Automotive Electronics

肖佐楠，苏州国芯科技股份有限公司总经理

Joe Xiao, CEO, C*Core Technology Co., Ltd.

14:30-14:50

自测PLL用于SoC设计

Self testing PLLs for Complex SoCs

CC Chen，Silicon Creations 模拟/混合信号设计总监

CC Chen, Director of Analog/Mixed-Signal Design, Silicon Creations

14:50-15:10

让MIPI成为您的盟友

Making MIPI Your Ally

卡蒂克, 智权半导体科技（厦门）有限公司总经理

Karthik Gopal, GM - Asia, SmartDV

15:10-15:30

开启RISC-V在高性能应用领域的时代

RISC-V is Moving to High-performance Application

周杰，广东赛昉科技有限公司资深销售总监

Jay Zhou, Senior Sales Director, Guangdong StarFive Technology Co., Ltd.

15:30-15:50

SiFive处理器系列产品发挥RISC-V无限潜力

Unlimited Potential of Industry-Leading SiFive RISC-V Processors

林宗民，SiFive产品营销资深经理

Tommy Lin, Senior Manager of Product Marketing, SiFive

15:50-16:10

半导体定律逐渐失效，SoC设计的未来将如何？

Scaling is Failing, What Next for SoC Design?

胡征宇，Codasip大中华区总经理

Zhengyu Hu, Country Manager of Grearter China, Codasip

16:10-16:30

RiVAI P600——睿思芯科高性能RISC-V数据中心处理器

RiVAI P600: High Performance RISC-V CPU for Data Centers

谭章熹，睿思芯科创始人兼CEO

Zhangxi Tan, Founder & CEO, RIVAI Technologies

16:30-16:50

RISC-V的崛起与Andes全系列落地应用解决方案

The Rise of RISC-V and the Total Application Solutions from Andes Technology

程明明，晶心科技技术服务经理

Albert Cheng, Manager of Solution Architecture Division, Andes Technology

16:50-17:10

CEVA技术赋能XR

CEVA XR Enabling Technologies

田元，CEVA销售总监

Rochester Tian, Sales Director, CEVA

17:10-17:30

国产接口IP助力中国芯互联

Domestic Interface IP Helps China’s Chips Interconnect

赵喆，牛芯半导体（深圳）有限公司副总经理

Zhe Zhao, Deputy GM, KNiulink Semiconductor Ltd.

17:30-17:35

幸运抽奖Lucky Draw

时  间

Time

内    容

Contents

演讲人

Lecturer

先进封装与测试（一）

Advanced Packaging and Testing (I)

主持人：周荣，中国半导体行业协会集成电路设计分会副秘书长

Moderator: Rong Zhou, Vice General Secretary, CSIA-ICCAD

08:40-09:00

集成电路需要CRO & CDMO

What Does CRO & CDMO Mean in the IC Industry？

郑朝晖，上海季丰电子股份有限公司董事长

Hanson Zheng, Chairman, Giga Force Electronics Co., Ltd.

09:00-09:20

多样封装技术平台助力集成电路成品开发

Multi-Packaging Technology Platforms Assist Integrated Circuit Product Development

林耀剑，江苏长电科技股份有限公司VP

Yaojian Lin, VP, JCET

09:20-09:40

封装集成技术趋势与解决方案

Package Challenges On SiP & FHEC' Solutions

钟磊，甬矽电子（宁波）股份有限公司, 研发总监

Lei Zhong, R&D Director, Forehope Electronic(NING BO) Co., Ltd.

09:40-10:00

高性能封装集成：机遇与挑战

Packaging Integration for High Performance Computing: Opportunity & Challenge

杜茂华，通富微电总监

Maohua Du, Director, TFME

10:00-10:20

如何迎接2.5D/3D先进封装时代所面临的挑战

How to Meet the Challenges in the Era of 2.5D/3D Advanced Packaging?

李方，上海合见工业软件集团有限公司应用工程总监

Andy Li, Applications Engineering Director, Shanghai UniVista Industrial Software Group Co., Ltd.

10:20-10:40

WiFi7芯片的射频测试

RF Measurement of WiFi7 Chips

付国映，罗德与施瓦茨技术经理

Guoyin Fu, Technical Manager of Rohde & Schwarz Communication Technology Co., Ltd.

10:40-11:00

车用电子封装趋势发展

Technology Trend & Package Solution for Automotive Application

沈政昌，日月光集团汽车工程处资深处长

Allen Shen, Senior Director of Automotive Engineering Division, ASE Group

11:00-11:20

半导体磨划设备技术进展与市场前景

Technical Progress and Market Prospect of Semiconductor Grinding Equipment

余胡平，沈阳和研科技有限公司总经理

Huping Yu, GM, Shenyang Heyan Technology Co., Ltd.

11:20-11:40

IC OPEN线路的失效分析方法

Failure Analysis Methodology for IC Open Circuit

陆高，蔚思博检测FA经理

Gary Lu, FA Manager, VESP Technology

11:40-12:00

紧跟“芯”浪潮之挑战，引领测试行业先锋

Test Technology – Keeping Up with the Industry Trend

于波, 泰瑞达(上海)有限公司现场产品专家

Beck Yu, Field Product Specialist,  Teradyne(Shanghai) Co., Ltd.

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:10

自助午餐Buffet Lunch

主持人：徐秀法，中国半导体行业协会集成电路设计分会副秘书长

Moderator: Xiufa Xu, Vice General Secretary, CSIA-ICCAD

13:00-13:10

先进封装材料CUF及LMC解决方案

Solutions of Advanced Packaging Materials CUF and LMC

徐龙飞，上海本诺电子材料有限公司技术经理

Longfei Xu, Technical Manager, Bonotec Electronic Material

13:10-13:30

晶圆级扇出型先进封装的趋势和挑战

Trends and Challenges of Wafer-level Fan-out Advanced Packaging

张闻来，杭州晶通科技有限公司销售总监

Jason Zhang, Sales Director, Hangzhou Microsilicon Technology Co., Ltd.

13:30-13:50

集成电路测试的挑战与机遇

Challenges and Opportunities of Integrated Circuit Testing

阚应东，合肥悦芯半导体科技有限公司市场经理

Yingdong Kan, Marketing Manager, Hefei TBSTest Technologies Co., Ltd.

13:50-14:10

浅谈汽车电子封装

Impressions of Automotive Electronic Packaging

刘卫东，华天科技技术市场总监

Wade Liu, Technology Marketing Director, HT-TECH

14:10-14:30

企业家的预见性——从分析测试赛道看半导体行业周期性

Entrepreneur's Inside: View of Semiconductor Industrial Cycle from Analytical Service Sector

李晓旻，胜科纳米（苏州）股份有限公司董事长

Xiaoming Li, CEO, Wintech-Nano (SuZhou) Co., Ltd.

14:30-14:50

三维系统集成与晶圆级扇出型封装技术进展

3D System Integration and Wafer Level Fan-out Packaging Technology

吕书臣，江苏中科智芯集成科技有限公司副总经理

Shuchen Lv, VP, CASMEIT

14:50-15:10

SiP先进封装行业的技术现状及发展趋势

Technology Status and Development Trend of SiP Advanced Packaging

谢建友，湖南越摩先进半导体有限公司CEO

Jianyou Xie, CEO, Hunan Overmoore Advanced Semiconductor Co., Ltd.

15:10-15:30

功率半导体特色封装和先进封装技术及挑战

Special Packaging and Advanced Packaging technology of Power Device and Challenges

龚平，华润微电子封测事业群研发经理

Ping Gong, R&D Manager, CRMICRO Assembly&Test Business Group

15:30-15:50

Thermal-芯片失效分析的指明灯

Thermal-The Guiding light of IC Failure Analysis

龚慧兰，泓准达电子科技（常州）有限公司研发部总监

Huilan Gong, R&D Director

, HZD Electronic Technology (Changzhou) Co., Ltd.

15:50-16:10

DaVinci 测试插座精准应对56/112G Serders PAM4 测试挑战的解决方案

How DaVinci Socket Tackle 56/112G SerDes PAM4 Test Challenges

徐益，史密斯英特康半导体测试事业部资深技术经理

Eason Xu, Senior FAE, Smiths Interconnect Business Unit

16:10-16:30

利用恩艾NI STS方案解决最新射频芯片测试挑战

Use NI Semiconductor Test System (STS) to Solve Latest RFIC Test Challenges

孙冶，上海恩艾仪器有限公司半导体业务拓展经理

Eason Sun, BDM, ShangHai Ni Instruments Co., Ltd.

16:30-16:50

先进封装技术在功率模块中的应用

Application of Advanced Packaging Technology in Power Module

何海平，天芯互联科技有限公司设计经理

Jerry He, DM, Sky Chip Interconnection Technology Co., Ltd.

16:50-17:10

ERS精准温控助力晶圆封测

ERS Precision Thermal Management Systems Assist Wafer Probing and Packaging

赵亢，ERS electronic GmbH大中国区产品经理

Kang Zhao, Great China Product Manager, ERS electronic GmbH

17:10-17:30

异构集成封装优化性能与成本

Heterogeneous IC Packaging, Optimizing Performance and Cost

王明波，安靠科技大中华区销售和市场副总监

Bibby Wang, Deputy Director of Greater China Sales & Marketing,

Amkor Technology, Inc.

17:30-17:50

光电共封技术发展与挑战

Development and Challenges of Co-Packaged Optics

李光耀，深圳市中兴微电子技术有限公司封测工程部部长

Guangyao Li, Director of Packaging and Testing, Sanechips Technology Co., Ltd.

17:50-17:55

幸运抽奖Lucky Draw

时  间

Time

内        容

Contents

演讲人

Lecturer

厦门集成电路产业创新发展高峰论坛

Xiamen IC Industry Innovation and Development Summit

主持人：待定

08:30-12:00

待定

12:00-13:10

自助午餐 Buffet Lunch

资本与IC设计业

VC and IC Design Industry

主持人：孙坚，石溪资本管理合伙人、中国半导体行业协会集成电路设计分会副秘书长

Moderator: Jian Sun, Vice General Secretary, CSIA-ICCAD

13:00-13:10

青岛集成电路胶州产业园推介 Introduction to the Integrated Circuit of Jiaozhou Industrial Park

胶州市政府

Jiaozhou People’s Government

13:10-13:30

回首过往，穿越周期

Look through the Past, Pass through the Cycles

王林，华登国际合伙人

Lin Wang, Partner, Walden International

13:30-13:50

集成电路产业在广东省发展布局的探讨 Explore of the Development and Strategy of the Integrated Circuit Industry in Guangdong Province

段哲明，中芯聚源董事总经理

Zheming Duan, Managing Director, China Fortune-tech Capital Co., Ltd.

13:50-14:10

半导体中局下的投资思考

Thoughts on the investment of semiconductor in the second half  section

殷伯涛，元禾璞华董事总经理

Botao Yin, Managing Director, Hua Capital

14:10-14:30

半导体热潮下中国半导体发展和投资机遇

Semiconductor Development and Investment Opportunities in China under the Semiconductor Upsurge

苏仁宏，湖杉资本创始合伙人

Tony Su, Founding Partner CEO, Allin Capital

先进封装与测试（二）

Advanced Packaging and Testing (II)

14:30-14:50

面向芯粒微系统集成的先进封装技术

Advanced Packaging Technologies for Chiplet Integration

王成迁，中科芯集成电路有限公司微系统制造部副主任

Chengqian Wang, Deputy Director of Microsystem Manufacturing Department, China Key System & Integrated Circuit Co., Ltd. 

14:50-15:10

泰治科技ATYMS-数据驱动芯片测试

Taizhi Technology ATYMS- Data Driven Semiconductor Test

詹昀谕，江苏泰治科技股份有限公司GMBD

Yunyu Chan, GMBD, Jiangsu Taizhi Technology Co., Ltd.

15:10-15:30

跨层分析：快速调试PCIE5.0异常

Debug PCIe5.0 Faster with Cross-layer Analysis Tools

李发存，美国力科公司市场经理

Denny Li, Marketing Manger, Teledyne Lecroy

15:30-15:50

稳定的量产测试方案开发

The Stable Test Plan Development for Chip Mass Production

赵庆，摩尔精英测试工程副总裁

Qing Zhao, VP of Test Engineering, MooreElite

15:50-16:10

系统集成-摩尔定律2.0

System-Level Scaling: Moore’s Law 2.0

林正忠，盛合晶微半导体（江阴）有限公司副总裁

ChengChung Lin, VP, SJ Semiconductor (JiangYin) Corp.

16:10-16:30

从模拟到数字，几种典型芯片测试方法

From Analog to Digital, Several Typical Chipset Test Methods

阳任平，是德科技中国区IC行业经理

Renping Yang, Greater China IC Industry Manager, Keysight

16:30-16:50

探索集成电路先进封装发展新趋势

Explore the New Development Trend of Advanced Packaging for Integrated Circuits

彭勇，池州华宇电子科技股份有限公司董事长兼总经理

Peter-Peng, GM, Chizhou HISEMI Electronics Technology Co., Ltd.

16:50-17:10

国产数字机推动IC测试迈上新台阶

Domestic ATE Pushes IC Testing to a New Level

邬刚，杭州加速科技有限公司创始人兼董事长

Eric Wu, Founder and Chairman, Hangzhou Speedcury Technology Co., Ltd.

17:10-17:30

系统级测试（SLT）赋能IC测试新机遇

System Level Test (SLT) New Opportunities in IC Test

彭晶，浙江芯晖装备技术有限公司Test BG总经理

Eric Peng, Test BG GM, Zhejiang Chip Sunshine Equipment Technology Co., Ltd.

17:30-17:50

新能源汽车趋势下，车用芯片测试的发展

Under the trend of New Energy Automobile, the development of testing in Automative Electronic Industry

葛樑，爱德万测试（中国）业务发展总监

Liang Ge, Director of Business Development, Advantest China

17:50-17:55

幸运抽奖 Lucky Draw

时  间

Time

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Contents

演讲人

Lecturer

EDA与IC设计创新

EDA and IC Design Innovation

主持人：刘娜，中国半导体行业协会集成电路设计分会副秘书长

Moderator: Na Liu, Vice General Secretary, CSIA-ICCAD

08:40-09:00

AI赋能实现更快、更好、更高效的芯片验证

Better, Faster, and More Efficient Verification with the Power of AI

谢剑，新思科技技术总监

Sward Xie, Technical Director, Synopsys

09:00-09:20

多FPGA逻辑验证系统的成功关键——性能优化

Performance Optimization: Key to the Success of Multi-FPGA Logic Verification Systems

孙亚强，思尔芯首席技术官

Richard Y. Sun, CTO, S2C

09:20-09:40

通过DTCO打造应用驱动的EDA解决方案

Create Application-Based EDA Solutions through DTC0

刘文超，上海概伦电子股份有限公司副总裁

Wenchao Liu, VP, Primarius Technology Co., Ltd.

09:40-10:00

时序驱动分割引擎，助力FPGA原型验证生产力提升

Improving the Performance of FPGA Prototyping System with Timing-Driven Partitioning Engine

董海，上海合见工业软件集团有限公司应用工程总监

Hai Dong, Applications Engineering Director, Shanghai UniVista Industrial Software Group Co., Ltd.

10:00-10:20

新一代EDA仿真与验证平台

Next Generation for EDA Emulation and Prototyping Platform

裘烨敏，芯启源电子科技有限公司EDA &IP销售总经理

Yemin Qiu, Sales GM of EDA & IP, Corigine

10:20-10:40

西门子 EDA - AI, 5G & 汽车芯片解决方案

Siemens EDA AI/5G/Automotive IC Solutions

牛风举，西门子EDA中国区产品总监

Actel Niu, Product Director, China, Siemens EDA

10:40-11:00

敏捷验证加速系统设计与架构创新

Agile Verification Speeds Up System Design and Architecture Innovation

傅勇，芯华章科技首席技术官

Yong Fu, CTO, X-EPIC

11:00-11:20

国微芯技术路线及产品布局

GWX Technology Roadmap and Product Line

白耿，深圳国微芯科技有限公司执行总裁/首席技术官

Geng Bai, Executive President/CTO, GWX Technology Co., Ltd.

11:20-11:40

面向下一代低功耗设计的静态验证工具

EnFortius Low Power Checker – A New Static Checking Tool for Next Generation Low Power Designs

熊文，英诺达（成都）电子科技有限公司副总经理

Wen Xiong, VP, Ennocad (Chengdu) Electronics Technology Co., Ltd.

11:40-12:00

基于FMEDA的功能安全全流程解决方案

FMEDA-Driven Analog/Mixed-Signal and Digital Safety Designer

许克龙，Cadence验证产品经理

Kelong Xu, Account Technical Executive, Cadence

12:00-12:05

幸运抽奖 Lucky Draw

12:05-13:10

自助午餐Buffet Lunch

主持人：沈磊，中国半导体行业协会集成电路设计分会副理事长

Moderator: Lei Shen, Vice General Director, CSIA-ICCAD

13:10-13:30

打造泛模拟芯片设计制造协同发展生态

Create A Collaborative Development of Ecology for Analog Related Chip Design And Manufacturing

刘晓明，北京华大九天科技股份有限公司产品总监

Michael Liu, Product Director, Empyrean Technology Co., Ltd.

13:30-13:50

芯之所至，皆有鸿芯——鸿芯微纳领跑国产数字后端EDA工具解决方案

Giga Design Automation Takes Lead in Domestic Digital Back-End EDA Tool Solutions

王宇成博士，深圳鸿芯微纳技术有限公司首席技术官&联合创始人

Dr. Yucheng Wang, CTO & Co-founder, Shenzhen Giga Design Automation Co., Ltd.

13:50-14:10

Chiplet技术与设计挑战

Chiplet Technology and Design Challenges

苏周祥，芯和半导体高级技术支持总监

Zachary Su, AE Director, Xpeedic Technology

14:10-14:30

快速而准确的特征化模型解决方案Viola

Viola: Library Characterization and Variation Modeling

石立丽，Silvaco 中国资深应用工程师

Lili Shi. Senior EDA Application Engineer. Silvaco China Co., Ltd.

14:30-14:50

国产EDA在先进封装领域的机遇和挑战

Opportunities and Challenges in the Field of Advanced Packaging of The Domestic EDA

张建超，芯瑞微（上海）电子科技有限公司Chiplet事业部总经理

Jianchao Zhang, GM of Chiplet Division, PHYSIM Electronic Technology Co., Ltd.

14:50-15:10

3DIC多物理场仿真解决方案

3DIC Multiphysics Solution

邹黎，安似科技（上海）有限公司高级应用工程师

Julia Zou, Senior Application Engineer, Ansys Shanghai, China

15:10-15:30

面向纳米级芯片相关专利的技术分析方法

Technology Analysis Method for Patents Related to nm Scale Chips

赵坤，上海奈芯软件科技有限公司技术顾问

Kun Zhao, Technical Consultant, Shanghai Nanochip Software Technology Co., Ltd.

15:30-15:50

先进工艺下芯片EMIR-Power-Thermal协同分析EDA解决方案

EMIR-Power-Thermal Collaborative Analysis of EDA Solutions

崔晓亮，杭州行芯科技有限公司产品总监

Xiaoliang Cui,Product Director, Hangzhou Phlexing Technology Co., Ltd.

15:50-16:10

设计汽车芯片功能安全

Design Function Safety for Automobile ASIC

陈晓挺，MathWorks通信、电子和半导体行业市场经理

Vincent Chen, CES Industry Marketing Manager, MathWorks

16:10-16:30

电子-光子设计自动化（EPDA）平台助力可扩展的硅光子芯片设计、验证和实现

An Electronic-Photonic Design Automation (EPDA) Platform that Enables the Scalable Silicon Photonic Circuit Design, Verification, and Implementation

陈昇祐，深圳逍遥科技有限公司产品总监

Terence S.-Y. Chen, Product Engineering Director, Latitude Design Automation Inc.

16:30-16:50

国产EDA助力芯片功能安全

Domestic EDA Assisting Chip Function Safety

管楠，上海芯思维信息科技有限公司FAE

Nan Guan, FAE, Shanghai Semisight Information Technology Co., Ltd.

16:50-17:10

打造自主可控的数字集成电路物理实现工具

Toward Domestic EDA Solutions for Digital Implementation

陈建利，上海立芯软件科技有限公司董事长兼首席科学家

Jianli Chen, Chairman&Chief Scientist, Shanghai LEDA Technology Co., Ltd.

17:10-17:30

使用STING激励生成工具验证RISC-V CPU和SoC

Using STING Stimulus Generator to Verify RISC-V CPU and SoC

王浩为，Valtrix Systems商务拓展经理

Tony Wang, BD Manager, Valtrix Systems

17:30-17:50

自动化是EDA的核心使命

Automation is Core Mission of EDA

朱允山，上海伴芯科技有限公司CEO

Yunshan Zhu, CEO, IC Bench, Inc.

17:50-17:55

幸运抽奖Lucky Draw

时  间

Time

内    容

Contents

演讲人

Lecturer

FOUNDRY与工艺技术

Foundry and Process Technology

主持人：何晓宁，陕西省半导体行业协会秘书长

Moderator: Xiaoning He, General Secretary, SSIA

08:40-09:00

先进300mm 65nm BCD能源管理平台：满足庞大能源市场需求的一流技术解决方案

Advanced 300mm 65nm BCD Power Management Platform – Best-in-class Technology Solutions Addressing the Extensive Power Market Needs

王敏，Tower Semiconductor销售&FAE经理

Min Wang, Sales & FAE Manager, Tower Semiconductor Ltd.

09:00-09:20

TSMC的先进逻辑工艺和3D集成技术

TSMC’s Leadership in Advanced Logic and 3D Integration Technology

孔玲，台积电中国区业务发展副总监

Yoyo Kong, China Business Development Deputy Director, TSMC

09:20-09:40

联电先进特色工艺

UMC Advanced Specialty Technologies

陈剑波，和舰芯片制造（苏州）股份有限公司销售经理

Snowwolf Chen, Sales Manager, HeJian Technology (Suzhou) Co., Ltd.

09:40-10:00

格芯：引领未来射频技术

Leading the Way to Future RF

张楷晨博士，格芯中国手机无线业务线经理

Dr. Calvin Zhang, Mobile Wireless Business Line Manager, GlobalFoundries China.

10:00-10:20

布局车规特色工艺，助力国产车用芯片发展

CSMC R&D Capability Of Automotive Grade ICs In Supporting Domestic Automotive Electronics Industry

杨涛，华润微代工事业群市场高级经理

Tao Yang, Senior Manager of FBG Marketing, CR Micro

10:20-10:40

X-FAB以模拟工艺连结现实世界

How X-FAB’s Analog Foundry Technologies Build a Bridge Between the Digital and the Real World

卫鹤鸣，X-FAB技术市场经理

Heming Wei, Technical Marketing Manager, X-FAB

10:40-11:00

高精度视觉和复杂人工智能检测技术推动半导体先进制造数字化转型 

Driving Semiconductor Advanced Manufacturing Digital Transformation with High Precision Vision and Complex AI Inspection Technology

于肖丰，聚时科技（上海）有限公司解决方案总监

Xiaofeng Yu, Solutions Director, Matrixtime Robotics Co., Ltd.

11:00-11:20

加速突围：芯片供应链全流程解决方案

IC Supply Chain Management Turnkey Solutions Energize Fabless Break Through

王龙，摩尔精英资深业务拓展总监

Long Wang, Senior Business Development Director, MooreElite

11:20-11:40

一体化芯片良率解决方案，后摩尔时代的创新机遇

Unified DTCO Platform for Yield Solutions, Opportunities in the Post-Moore Era

俞宗强，东方晶源微电子科技（北京）有限公司董事长兼首席技术官

Zongchang Yu, Chairman/CTO, Dongfang Jingyuan Electron Limited

11:40-12:00

高可靠性钝化及介电材料

High Reliability Passivation & Dielectric Resin

雷雨，住友电木市场部经理

Uchair Lei, Manager of Marketing and Sales, SUMITOMO BAKELITE Co., Ltd.

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:10

自助午餐 Buffet Lunch

IC设计与应用

IC Design & Application

主持人：王志华，中国半导体行业协会集成电路设计分会副秘书长

Moderator: Zhihua Wang, Vice General Director, CSIA-ICCAD

13:10-13:30

安路科技FPGA技术变革和在汽车应用上的布局

Anlogic FPGA : Tech Innovation and Strategy In Automotive Industry

邓龙, 上海安路信息科技股份有限公司市场部总监

Alex Deng, Marketing Director, Shanghai Anlogic Infotech Co., Ltd.

13:30-13:50

DPU芯片创新设计，引领数据中心架构变革

The Innovative Design of DPU Chips Leads the Transformation of Data Center Architecture

马国强，星云智联产品线副总裁

Patrick Ma, VP of Product Line, NebulaMatrix

13:50-14:10

22nm产品创新突破，助力国产FPGA新发展

Breakthrough Innovation in 22nm Technology as a Driving Force to the New Development of China's FPGA Industry

王锋，京微齐力销售副总

Kevin Wang, Sales VP, HME

14:10-14:30

云豹智能DPU引领数据中心新趋势 JaguarMicro's DPU Leads the New Trend of Data Center

Frey Li，云豹智能产品&市场负责人

Frey Li, Head of Products and Marketing, JaguarMicro

14:30-14:50

TinyML助力万物智联

TinyML Facilitates AIoT

杨宠能，恒烁半导体（合肥）股份有限公司AI市场拓展总监

Peter Yang, Director of AI Market Development, Zbit Semiconductor, Inc.

14:50-15:10

“芯”向5.5G时代

Terminal Chipset Design for 5.5G Era

潘振岗，紫光展锐中央研究院副总裁

Zhengang Pan, IEEE Senior Member, VP and head of Advanced Comm. Tech. Lab, Central Research Institute of UNISOC

15:10-15:30

蓝牙低功耗(BLE)技术特点及其应用趋势

Technical Characteristics and Applications Trends of Bluetooth Low Energy (BLE)

蔡光杰，北京昂瑞微电子技术股份有限公司SoC研发部高级副总裁

Jacky Guangjie Cai, Senior VP of SoC BU, Beijing Onmicro Electronics Co., Ltd.

15:30-15:50

面向非相干光网络的芯方案

Chip Solution in New Data Center Network

余长亮，武汉飞思灵微电子技术有限公司模拟IC技术专家、武汉市黄鹤英才产业领军人才

Yu Changliang, Wuhan“Yellow Crane Talent” Industry Leader, Analog IC  Technician, WuHan Fisilink Microelectronics Technology Co., Ltd.

15:50-16:10

面向“云”的多芯片方案

Cloud Optimized Multidie

牛佳，迈威迩电子科技有限公司资深总监

Jia Niu, Senior Director, Marvell

16:10-16:30

国产车规Flash发展新机遇

New Development Opportunities Driving Boom for Domestic Automotive-grade Flash

李嶷云，兆易创新科技集团股份有限公司市场资深主管

Cruise Li, Senior Marketing Supervisor, GigaDevice Semiconductor Inc.

16:30-16:50

突破核心技术，力通公司助力 5G基站收发芯片的国产化进程

Breaking Through the Core Technology, Beijing Litong Helps the Localization Process of 5G Base Station Transceiver Chips

王勇，北京力通通信有限公司市场销售总经理

Nelson Wang, GM of Sales & Marketing, Beijing Litong Communication Co., Ltd.

16:50-17:10

Wi-SUN助推能源物联网建设

Wi-SUN Promotes the Construction of Energy Internet of Things(IoT)

胡泽鑫，珠海中慧微电子有限公司技术总监

Zexin Hu, Technical Director, ZhuHai ZhongHui Microelectronics Co., Ltd,

17:10-17:30

国产处理器助力集成电路高性能设计平台

Domestic Processors Help Integrated Circuit High-performance Design Platform

刘洋，合芯科技有限公司CTO & 副总裁

Yang Liu, CTO & VP, HEXIN Technologies Co., Ltd.

17:30-17:35

幸运抽奖Lucky Draw

时  间

Time

内    容

Contents

演讲人

Lecturer

EDA云赋能人工智能

EDA Cloud Empower AI

主持人：刘岩，中国半导体行业协会集成电路设计分会副秘书长

Moderator: Liu Yan, Vice General Director, CSIA-ICCAD

08:40-09:00

车规级高性能芯片推动自动驾驶商业化落地

Automotive-grade High-performance Chips Drive Commercialization of Autonomous Driving

额日特，黑芝麻智能科技有限公司高级产品市场经理

Eric E, Senior Product Marketing Manager, Black Sesame Technologies Co., Ltd.

09:00-09:20

数字化时代，IC企业如何构建安全、高效的研发工作环境

See How ZShield Supports IC Company Secure the Digital Workplace the Multi-cloud Era

何轶，北京志翔科技股份有限公司解决方案总监

Yi He, Director of Industry Solution, Zshield Inc.

09:20-09:40

用AI赋能EDA，构建新一代数字实现EDA平台

Empowering EDA with AI to Build a New Generation Digital Implementation EDA Platform

陶然，芯行纪科技有限公司资深业务总监

Ran Tao, Senior Business Director, X-Times Design Automation Co., Ltd.

09:40-10:00

亚马逊云科技加速芯片设计

Explore Semiconductor Design and Innovation in the Cloud

周宇，亚马逊云科技高科技行业拓展总监

Kevin Zhou, Principal IBD, Manufacture, Amazon Web Service

10:00-10:20

EDA行业上云分析及最佳实践分享

Taking EDA to the Cloud: Analysis & Use Cases

张利国，深圳北鲲云计算有限公司 EDA行业解决方案专家

Liguo Zhang, EDA Solution Expert, Shenzhen BKUNYUN,. Ltd.

10:20-10:40

CAD赋能芯片设计

How does CAD Speed up IC Design?

梁尚锋，摩尔精英 IT/CAD技术总监

Shangfeng Liang, Director of IT/CAD Services, MooreElite

10:40-11:00

如何确保系统单芯片效能满足您的要求

How to Ensure the SoC Performance Meet Your Requirements

王俊凯，撷发科技业务暨行销副总经理

Roger Wang, VP of Sales and Marketing, MicroIP Inc.

11:00-11:20

 “虚拟工厂”大数据分析与管控平台，助力本土设计公司工程及量产快速落地

Virtual Subcon Big Data Analysis & Management Platform Support eng & mfg of Local Fabless Launched Effectively.

朱恝燕，芯湖科技产品市场副总

Martina Zhu, VP of Product Marketing, Zhejiang Smart High-Tech. Co., Ltd.

11:20-11:40

比昂芯 - 云端分布式计算加速电路仿真与设计

BTD Technology – Cloud-based Distributed Computing for Faster Circuit Simulation and Design

吴胜，比昂芯科技CEO

Sheng Wu, CEO, BTD Technology

11:40-12:00

穿越周期，破关拓土-IC设计公司数智转型路径分享

Transformation of Digitalization Helps to Fight Against Economic Risks and Seek a New Way Out

耿俊强，鼎捷软件股份有限公司IC设计行业专家

Junqiang Geng, IC Design Industry Expert, Digiwin Software Co., Ltd.

12:00-12:05

幸运抽奖Lucky Draw

12:05-13:10

自助午餐 Buffet Lunch

主持人：柯炳粦，厦门市集成电路行业协会会长

Moderator: Binglin Ke, Chairman, Xiamen Integrated Circuit Industry Association

13:10-13:30

WTM存內计算芯片应用及发展

Application and Development of Computing-in-memory Chip

王绍迪，知存科技创始人兼CEO

Shaodi Wang, Founder & CEO, Beijing Zhicun (Witmem) Technology Co., Ltd.

13:30-13:50

构筑半导体数字化底座，助力行业高质量发展

Build a Digital Foundation to Help the High-quality Development of the Semiconductor Industry

施晓冬，华为技术有限公司半导体电子行业顾问

Xiaodong Shi, Consultant of Semiconductor and Electronics Industry, HUAWEI Technologies Co., Ltd.

13:50-14:10

一站式集成电路设计云平台

One-stop IC Design Cloud Platform

梁璞，上海楷领科技有限公司业务副总裁

Pu Liang, VP, Kailing Technology (Shanghai) Co., Ltd.

14:10-14:30

超宽带(UWB)芯片射频模拟前端的设计分析与探讨

The Analysis of the Analog Front End of an Ultra-Wideband Transceiver IC

冯琪，苏州芯联成软件有限公司电路工程处经理

Qi Feng, Head of IC Analysis Department, Suzhou Silintech Company  

14:30-14:50

开源生态赋能AI加速器设计

AI Accelerator Design Powered by Open Source Ecosystem

唐琦，爱芯元智半导体(上海)有限公司AI推理引擎总监

Qi Tang, Director of AI Engine,

AXera Semiconductor (Shanghai) Co., Ltd.

14:50-15:10

用存算一体助力智能驾驶算力革命

Powering the Arithmetic Revolution of Smart Driving with Compute-In-Memory   

邵春园，后摩智能供应链负责人

Chunyuan Shao, Supply Chain Lead, HOUMO AI

15:10-15:30

异构验证云助力设计验证

Benefits of Heterogeneous Verification

林铠鹏，思尔芯总裁

KP Lin, President, S2C Limited

15:30-15:50

存算一体技术赋能智能芯片

Processing-In-Memory Technology Enables AI Chips

燕博南，苹芯科技首席科学家、北京大学研究员

Bonan Yan, Chief Scientist, Pimchip Technology, Assistant Professor, Peking University

15:50-16:10

芯片设计制造全链云平台助力企业降本增效

Full Chain Cloud Platform for Chip Design and Manufacturing Helps Enterprises Reduce Costs and Increase Efficiency

秦毅，中科芯云微电子科技有限公司常务副总经理

Yi Qin, VP, Chip Cloud Microelectronics Technology Co., Ltd.

16:10-16:30

亿铸科技：基于ReRAM的存算一体AI大算力芯片技术

Yizhu Technology: The ReRAM-based Computing In Memory Technology for AI High Computing Throughput Chips

熊大鹏，亿铸科技创始人、董事长兼CEO

Dapeng Xiong, Founder, President & CEO, Yizhu Intelligent Technology Co., Ltd.

16:30-16:50

专注芯机联动，创赢生态伙伴

Focus on Chip-Machine Interaction, Building Successful Ecosystem with Partners

周严爱凌，江苏北联国芯技术有限公司技术创新中心生态发展部部长

Yanailing Zhou, Director of Creative Center and Ecology Development, Jiangsu Beilian Computing Co.,Ltd.

16:50-17:10

HPC和研发Flow管理平台提升EDA产品开发效率

HPC and R&D Flow Management Platform Improve EDA Product Development Efficiency

王轶华，Altair企业计算部技术经理

Yihua Wang, Technical Manager of Enterprise Computing Group, Altar

17:10-17:15

幸运抽奖Lucky Draw