中国集成电路设计业2021年会
暨无锡集成电路产业创新发展高峰论坛
CSIA-ICCAD 2021 Annual Conference &
Wuxi IC Industry Innovation and Development Summit
会议日程
Agenda
2021年12月22日,星期二
Dec. 22, Tuesday, 2021
地点:无锡太湖国际博览中心A6馆
Venue: A6 Hall, 2F, Wuxi Taihu International Expo Center
时 间
Time
|
内 容
Contents
|
开 幕 式
Opening Ceremony
|
主持人:高亚光,无锡市人民政府副市长
Moderator: Yaguang Gao, Deputy
Mayor of Wuxi Municipal People's Government
|
08:30-09:00
|
中国半导体行业协会领导致词
Address, Leader of CSIA
|
领导、嘉宾致辞
Address, Leader and Guest
|
无锡市人民政府领导致辞
Address,
Leader of Wuxi Municipal People's Government
|
高峰论坛
Top Forum
|
主持人:程晋格,中国半导体行业协会集成电路设计分会秘书长
Moderator: Jinge Cheng, General
Secretary, CSIA-ICCAD
|
09:00-09:30
|
实干推动设计业不断进步
—
魏少军教授,中国半导体行业协会集成电路设计分会理事长
Working Hard Toward Excellence
-
Prof. Shaojun Wei, General Director,
CSIA-ICCAD
|
09:30-09:50
|
无锡集成电路产业介绍
—
崔荣国,无锡国家高新区管委会主任、新吴区区长
Introduction of Wuxi IC Industry
-
Rongguo
Cui, Director of Wuxi National Hi-Tech District Management Committee, District Mayor of Xinwu District
|
09:50-10:10
|
联合演讲:以SysMoore探索数字寰宇
-
Sassine
Ghazi,新思科技总裁兼首席运营官
-
葛群,新思科技全球资深副总裁兼中国董事长
Co-speech: SysMoore
- Shape the Digital World
-
Sassine Ghazi, President and Chief Operating
Officer, Synopsys
-
Magic Ge, Global VP and Chairman of China, Synopsys
|
10:10-10:30
|
三项关键准备,迎接下一个芯片黄金十年
— 林伟圣,和舰芯片制造(苏州)股份有限公司副总经理
Challenges and Opportunities Post-Pandemic
-
W S Lin, VP, HeJian
Technology (Suzhou) Co., Ltd.
|
|
国产数字芯片EDA新前沿:AI,云,异构计算
— 王宇成,深圳鸿芯微纳技术有限公司CTO
The New Frontiers in
National Digital EDA: AI, Cloud and Heterogeneous Computing
-
Yucheng
Wang, CTO, Giga Automation Ltd.
|
|
新一轮“超级周期”唤醒半导体产业新动能
—
彭启煌,西门子 EDA全球资深副总裁,亚太区总裁
The
Exciting New Super-Cycle in Semiconductor
-
Danny Perng, Senior Vice President, PacRim, Siemens EDA
|
|
Chiplet的产业化之路
—
戴伟民,芯原股份创始人、董事长兼总裁
The
Roadmap to Deploy Chiplet
-
Wayne Dai, Chairman, President and CEO, VeriSilicon
|
|
半导体产业的新时代
—
罗镇球,台积电(中国) 总经理
New
Era of Semiconductor Industry
-
Roger Luo, President, TSMC China
|
|
生生不息,智以驭器——开拓EDA无尽边际
—
汪晓煜,Cadence公司中国区总经理
Innovative
Intelligent System Design to Expand New Paradigm of EDA
-
Xiaoyu Wang, GM of China,
Cadence Design Systems, Inc.
|
12:10-13:20
|
自助午餐 Buffet Lunch
|
主持人:陈大同,中国半导体行业协会IC设计分会副理事长
Moderator: Datong Chen, Vice
General Director, CSIA-ICCAD
|
13:15-13:20
|
幸运抽奖 Lucky
Draw
|
13:20-13:40
|
核芯动力XPU:定义全新的融合计算架构
—
吴雄昂,安谋科技执行董事长兼首席执行官
XPU: Defining the New
Multi-Domain Specific Architecture (xDAS)
-
Allen
Wu, Executive Chairman & CEO, Arm China
|
13:40-14:00
|
对接整机企业,协同产业供给
—
彭进,中芯国际集成电路制造有限公司资深副总裁
Linking with System Companies, Soothe Wafer Shortage
-
John Peng, SVP, SMIC
|
14:00-14:20
|
应用牵引,创新拥抱——构建自主EDA行业支撑平台
— 郭继旺,华大九天副总经理
Application
Drives Innovation——To
Construct Domestic EDA Platform
-
Jiwang Guo, VP, Empyrean Technology
|
14:20-14:40
|
开创更广阔的新纪元
—
王光伟,格芯副总裁兼中国区销售总经理
Delivering
an Era of More
-
Gary Wang, VP, GM of China Sales, GlobalFoundries
|
14:40-15:00
|
半导体IP和芯片定制国产化的技术发展趋势
—
敖海,芯动科技有限公司首席执行官
The Technology Localization Trend of Silicon IP
and Custom ASIC
-
Gordon Ao, CEO, INNOSILICON Technology
Ltd.
|
15:00-15:20
|
通用算力的需求与机遇
— 杨建,沐曦集成电路(上海)有限公司CTO
The
Demands and Opportunities of General-purpose Computing
-
Jian Yang, CTO, MetaX Integrated Circuits (Shanghai) Co., Ltd.
|
15:20-15:35
|
茶歇,交流,抽奖Coffee
Break,
Lucky Draw
|
15:35-15:55
|
应用牵引,立足创新,构建芯片验证新生态
—
王礼宾,芯华章科技董事长兼CEO
Building a New Ecology of Chip Verification with Application
and Innovation
-
Alex Wang, Chairman and CEO, X-EPIC
|
15:55-16:15
|
一站式芯片设计和供应链平台,助力芯片公司实现降本增效
—
张竞扬,摩尔精英董事长兼CEO
One-stop IC Design and Supply Chain Platform to Improve Efficiency
-
JY Zhang, Chairman & CEO, MooreElite
|
16:15-16:35
|
联动设计与制造,打造创新EDA解决方案
— 刘志宏博士,上海概伦电子股份有限公司董事长兼CEO
Innovative EDA Solutions to Bridge IC Design & Fabrication
-
Dr. Zhihong Liu, Chairman and CEO, Primarius
Technologies Co., Ltd.
|
16:35-16:55
|
协同创新,共建功率半导体产业生态链
— 苏巍,华润微电子代工事业群总经理
Build Power Semiconductor Industry Ecological Chain with Collaboration
& Innovation
-
Wei Su,
GM of Foundry Business Group, China Resources Microelectronics Co., Ltd.
|
16:55-17:15
|
Tower Semiconductor – 引领模拟生态系统,创造全周期价值
—
秦磊,Tower Semiconductor全球副总裁
Tower Semiconductor – Leading the Analog Ecosystem with Full
Circle Value Creation
-
Lei Qin, Global VP, Tower Semiconductor Ltd.
|
17:15-17:35
|
区域集成电路产业生态打造的思考和实践
—
时龙兴,东南大学首席教授,南京集成电路产业服务中心(ICisC)主任
Thinking and Practice of Building a Regional Integrated Circuit
Ecosystem
-
Longxing Shi, Currently the Chief Professor of Southeast University, the Director
of Nanjing Integrated Circuit Industry Service Center (ICisC)
|
17:35-17:45
|
第十届IC设计业企业家颁奖
The 10th IC Design Industry Entrepreneur Award
Ceremony
|
17:45-17:50
|
交旗仪式
Flag Handover Ceremony
|
17:50-17:55
|
幸运抽奖 Lucky
Draw
|
2021年12月23日,星期三
Dec. 23, Wednesday, 2021
专题论坛(一)
Subject
Forum (Ⅰ)
地点:无锡君来世尊酒店一楼梅花厅A
Venue: Mei Ballroom A, 1F, Worldhotel
Grand Juna Wuxi
时 间
Time
|
内 容
Contents
|
演讲人
Lecturer
|
IP与IC设计服务(一)
IP and IC Design Service (I)
|
主持人:余成斌,中国半导体行业协会集成电路设计分会副理事长
Moderator: Seng-Pan (Ben) U, Vice General Director, CSIA-ICCAD
|
08:40-09:00
|
国产高性能接口IP的进展和量产解决方案
Progress of Domestic High-performance Interface IP and Mass Production
Solutions
|
高专,芯动科技有限公司VP/技术总监
Zachary Gao, VP/Technical Director, INNOSILICON Technology
Ltd.
|
09:00-09:20
|
专注打造精品IP,以匠心成就客户
Devoting to High-quality IP and Achieving
Customer Success with Superb Technology.
|
李孟璋,芯耀辉科技有限公司CTO
MC Lee, CTO, Akrostar Technology Co., Ltd.
|
09:20-09:40
|
平板电脑高性能应用处理器芯片及软件解决方案
High Performance Application Processor and Software Solution
for Tablet Computer
|
汪志伟,芯原股份高级副总裁、系统平台解决方案事业部总经理
Zhiwei (Wiseway) Wang, SVP,
GM of System Platform Solution Division, VeriSilicon
|
09:40-10:00
|
智能计算时代的计算架构演进趋势
The Evolution Trend Of The Computing Architecture In The
Intelligent Computing Era
|
KengSu Teoh,安谋科技XPD工程总监
KengSu Teoh, Director of XPD Engineering, Arm China
|
10:00-10:20
|
锐成芯微WiFi6射频IP加速新一代物联网芯片崛起
Actt WiFi6 RF IP Accelerates the Development of Next Generation
IoT SoC
|
杨毅,成都锐成芯微科技股份有限公司VP
Yi Yang, VP, Chengdu Analog Circuit Technology Inc.
|
10:20-10:40
|
重塑人们出行方式的硅基平台
Reform the Way People Move by Silicon Platform
|
杨宜,索喜科技(上海)有限公司总经理
Rayman
Yang, GM, Socionext Shanghai
|
10:40-11:00
|
私有云在IC验证中的应用
Private Cloud in IC Verification
|
王登宝,上海合见工业软件集团有限公司
Deng
bao Wang, UNIVISTA
|
11:00-11:20
|
Maximizing SoC Bandwidth using Dynamic Voltage and Frequency
Scaling
|
Andrew
Cole, CC Chen, Randy Caplan, Silicon Creations
|
11:20-11:40
|
IP国产化的困境与芯思原的破局思考
The Dilemma of IP Localization and VeriSyno’s Thinking
|
王尚元,芯思原微电子有限公司技术支持经理
Shangyuan
Wang, Technical Support Manager, VeriSyno Microelectronics Co., Ltd.
|
11:40-12:00
|
国产FPGA赋能ADAS
Domestic
FPGA Empowers ADAS
|
王添平,广东高云半导体科技股份有限公司CTO
TP Wang,
CTO, GOWIN SEMICONDUCTOR CORP.
|
12:00-12:05
|
幸运抽奖Lucky Draw
|
12:05-13:10
|
自助午餐 Buffet Lunch
|
主持人:徐璐琦,中国半导体行业协会集成电路设计分会副秘书长
Moderator: Luqi Xu, Vice General
Secretary, CSIA-ICCAD
|
13:10-13:30
|
专业设计服务助力客户成功
Professional Design Services Help Customers
Succeed
|
闫银宝,上海申首半导体科技有限公司副总经理
Rimbo Yan, VP, Shanghai S1semi Technology
Co., Ltd.
|
13:30-13:50
|
领先图形处理技术赋能数字化生活
Leading Graphics Processing
Technology Enables Digital Life
|
李安,Imagination公司AI及SoC技术专家
Adam Li, Principle Application Engineer, Imagination
|
13:50-14:10
|
Secure-IC Integrated Secure Element, 为您的芯片带来信任根并满足多种安全标准
Secure-IC Integrated Secure Element,
Brings Root of Trust and Standard Compliance to Your Chip
|
汪盛楠,Secure-IC 大中华区销售与市场经理
Shengnan Wang, Sales & Marketing Manager
of Greater China, Secure-IC
|
14:10-14:30
|
新世代芯片互联技术,重新定义系统设计
Next Generation Chip Interconnection Technology
Redefines System Design
|
陈博宇,OpenFive高级销售总监
Alex Chen, Senior Sales Director, OpenFive China
|
14:30-14:50
|
IP定制,为IC设计加速助力
IP Customization Accelerates IC
Design
|
罗培君,四川和芯微电子股份有限公司销售经理
Peijun
Luo, Sales Manager, IPGoal Microelectronics (Sichuan) Co., Ltd.
|
14:50-15:10
|
中科芯蕊-国产超低功耗MCU的创新领导者
Zhongke
Xinrui-Innovative Leader of Ultra Low Power MCU
|
胡晓宇,北京中科芯蕊科技有限公司总经理
Xiaoyu Hu, CEO, Beijing Zhongke Xinrui Technology Co., Ltd.
|
15:10-15:30
|
AI赋能IoT行业新的机遇
AI Enables New Opportunities in the
IoT Industry
|
宋一平,CEVA公司OEM BD
Patrick Song, OEM Business
Development, CEVA
|
15:30-15:50
|
基于RISC-V的嵌入式安全域IP
SECURITY ENCLAVE Based on RISC-V
|
谢林,SilexInsight大中华区负责人
Tony Xie, Head of Greater China,
SilexInsight
|
15:50-16:10
|
IC设计中的颠覆 — AI
& ML
Disruptions in IC Design – AI &
ML
|
卡蒂克,智权半导体科技(厦门)有限公司总经理
Karthik Gopal, Asia GM, SmartDV Technologies
|
16:10-16:30
|
摩尔精英平台化定制芯片设计服务
MooreElite IC Design Service Platform
|
钟明宇,摩尔精英芯片设计服务技术支持经理
Ryan
Zhong, Field Application Manager, IC Design Service, MooreElite
|
16:30-16:50
|
通过RISC-V使能的AIoT系统挖掘数字化价值
Capture Value of Digitization via RISC-V Enabled
AIoT System
|
江朝晖,广东跃昉科技有限公司CEO/ CTO
Aglaia Kong, CEO/CTO, GuangDong LeapFive Technology Co., Ltd.
|
16:50-17:10
|
电子城ICC:营造集成电路设计“芯”氛围
Creating a New Air of IC Design
|
兰文丽,北京电子城集成电路设计服务有限公司总经理
Wenli Lan, GM, Beijing Electronics
Zone Integrated Circuit Design and Service Co., Ltd.
|
17:10-17:30
|
“即插即用”模块加速新型AI 芯片的设计实现
"Plug-n-Play" Modules Accelerate
Implementation of New ML/AI ASIC Designs
|
张爱东,顺卓微电子(西安)有限公司亚太区工程部负责人
Albert Zhang, Regional Head of
Engineering APAC, Sondrel (Xi’an) Co., Ltd.
|
17:30-17:50
|
高性能运算/人工智能设计和2.5D/3D先进封装
HPC/AI Design and 2.5D/3D Advanced Package
|
温德鑫,世芯电子上海分公司经理
Daniel Wen, Site Manager of Shanghai,
Alchip Technologies
|
17:50-17:55
|
幸运抽奖Lucky
Draw
|
2021年12月23日,星期三
Dec. 23, Wednesday, 2021
专题论坛(二)
Subject Forum (II)
地点:无锡君来世尊酒店一楼梅花厅B
Venue: Mei Ballroom B, 1F, Worldhotel
Grand Juna Wuxi
时 间
Time
|
内 容
Contents
|
演讲人
Lecturer
|
IP与IC设计服务(二)
IP and IC Design Service (II)
|
主持人:李军,中国半导体行业协会集成电路设计分会副秘书长
Moderator: Jun Li, Vice General
Secretary, CSIA-ICCAD
|
08:40-09:00
|
创意电子2.5D/3D多芯片集成技术方案实现介绍 - 助力AI/HPC/Networking等芯片量产实现
GUC
2.5D and 3D Multi-die Integration Solution
|
肖有军, 创意电子股份有限公司上海设计中心总监
YJ Xiao, Director,
Global Unichip Corporation (GUC)/CIDS
|
09:00-09:20
|
今日设计,赋能未来数据:利用芯片遥测技术进行全生命周期性能和可靠性监测
Designing Today for Data Tomorrow: Lifetime Performance &
Reliability Monitoring using Chip Telemetry
|
Roger
Lin,proteanTecs大中华区应用工程总监
Roger
Lin, Director Application Engineering, Greater China, proteanTecs
|
09:20-09:40
|
台积公司设计生态赋能产品创新,共创美好未来
Enabling Product Innovation for a Brighter Future: 2021
Design Ecosystem Update
|
陈敏,台积电技术支持副总监
Amy
Chen, Technical Support Deputy Director, TSMC
|
09:40-10:00
|
eNVM技术,让BCD工艺平台如虎添翼
Embedded Non-Volatile Memories Make
BCD Platforms More Powerful
|
王明,成都锐成芯微科技股份有限公司器件研发总监
Samuel
Wang, Device Director, Chengdu Analog Circuit Technology Inc.
|
10:00-10:20
|
各展所长,合作共造中国芯
Develop
Strongpoint to Make a China Core
|
何俊举,上海佩纶半导体有限公司联合创始人
Jessy
He, Co-Founder, peilunsemi
|
10:20-10:40
|
赛昉科技赋能高性能RISC-V应用生态发展
StarFive
— Empowering the Development of RISC-V High Performance Application Ecosystem
|
周杰,赛昉科技有限公司销售总监
Jay Zhou, Senior Sales Director, StarFive Technology Co., Ltd.
|
10:40-11:00
|
2009-2022年IP-XACT标准的发展演变
IP-XACT’s Evolution from 2009 to 2022
|
曾品翰,Arteris中国区的技术支持经理
William
Tseng, Field Applications Engineer Manager, Arteris IP
|
11:00-11:20
|
55nm~14nm自主开发IP及SoC平台加速量产解決方案
Fast Time-to-market — Faraday’s Owned-designed IP & SoC
Platform at 55nm~14nm
|
孔晓彬,智原科技ASIC技术顾问
Bruce Kong, ASIC Technical Consultant,
Faraday
|
11:20-11:40
|
异构多核:5G和AI时代芯片核心设计技术
Heterogeneous
Multi-Core:Key
Tech of 5G&AI Era Chip Design
|
谷建余,无锡华大国奇科技有限公司 CEO
Jianyu Gu, CEO, Qualchip
Technologies, Inc.
|
11:40-12:00
|
后疫情时代,如何迎接高性能运算、物联网与车用电子芯片的发展
In the Post-epidemic Era, How to Embrace the Development of
HPC, IoT and Automotive Electronic Chips
|
王宏康,芯测科技股份有限公司资深业务经理
Bill Wang, Senior Sales Manager, iSTART -TEK. INC.
|
12:00-12:05
|
幸运抽奖Lucky
Draw
|
12:05-13:10
|
自助午餐 Buffet Lunch
|
主持人:赵建忠教授,中国半导体行业协会集成电路设计分会副秘书长
Moderator: Prof. Jianzhong Zhao,
Vice General Secretary, CSIA-ICCAD
|
13:10-13:30
|
安全信任根 – 守护芯片安全
Root of Trust – Secure Your Chip
|
包乌日吐,深圳市纽创信安科技开发有限公司安全方案顾问
Stanley Bao, Security Solution Consultant, Open
Security Research, Inc.
|
13:30-13:50
|
国产汽车电子关键技术突破与应用
Breakthrough and Application of Key Technology of Domestic
Automotive Electronics
|
肖佐楠,苏州国芯科技股份有限公司总经理
Joe Xiao, CEO,
C*Core Technology Co., Ltd.
|
13:50-14:10
|
RISC-V开放架构在“中国芯”进程中的机遇与挑战
The
Opportunities and Challenges in Applying RISC-V Architecture to Build the
Chinese Self-control Chips
|
李珏,芯来科技市场及战略VP
Li Jue, Vice President of Strategy and
Marketing, Nuclei
|
14:10-14:30
|
RISC-V嵌入式处理器架构成为芯标准
RISC-V: A New Industry Standard
|
程明明,Andes技术服务经理
Albert Cheng, Manager of Technical
Service, Andes Technology
|
14:30-14:50
|
爱芯元智:AI ISP——人工智能视觉芯片的成像之美
Axera: AI ISP - How to get better
video on AIvision chips
|
张兴,爱芯元智ISP负责人、系统架构师
Xing Zhang, ISP System Architect, Axera
|
14:50-15:10
|
西门子旗下EDA产品OneSpin助力实现精确的验证覆盖率指标
Siemens EDA OneSpin:Precise Coverage Metrics Equals
Higher Verification Quality
|
陈维嵬,OneSpin: a Siemens Business中国区技术经理
Wei Wei Chen, Technical Manager for
China, OneSpin: a Siemens Business
|
15:10-15:30
|
加速处理器核心设计自动化
Design Automation for Accelerating
Processor Core Design
|
相海英,Codasip中国总经理,
Tina Xiang, China GM, Codasip
|
15:30-15:50
|
基于RF SOI的NB IoT射频前端
NB
IoT Front End based on RF SOI
|
杨文伟,上海新微技术研发中心有限公司研发总监
Wenwei
Yang, R&D Director, Shanghai Industrial uTechnology Research Institute
|
15:50-16:10
|
灿芯助力中芯国际先进工艺及生态系统
What can Brite Bring to the SMIC Ecosystem?
|
赵飞,灿芯半导体(上海)股份有限公司项目管理总监
Timothy Zhao, TSM/PM Director,
Brite Semiconductor (Shanghai) Co., Ltd.
|
16:10-16:30
|
打造先进存储芯片的一站式设计服务
Build the Advanced Storage Controller
by One-stop Design Service
|
罗挺,得一微电子股份有限公司市场总监
Roddy Luo, Marketing Director,
YEESTOR Microelectronics Co., Ltd.
|
16:30-16:50
|
高速连接未来——国产接口IP深耕者
High-speed Connection Future-Domestic IP Interface Deep Tiller
|
赵喆,牛芯半导体(深圳)有限公司副总经理
Zhe Zhao, Deputy GM, KNIULINK. Co., Ltd.
|
16:50-17:10
|
不一样的IP,不一样的ASIC
Specialized
IP, and Specialized ASIC
|
王洪鹏,中茵微电子(南京)有限公司执行董事
Jason
Wang, Executive Director, JoinSilicon Microelectronics (Nanjing) Co., Ltd.
|
17:10-17:30
|
志翔科技为IC企业构建安全高效的研发环境
ZShield: Secure the Workplace for IC Company
|
何轶,志翔科技解决方案总监
Yi He, Director of Solution, Zshield Inc.
|
17:30-17:50
|
卡姆派乐IDE对RISC-V架构HarmonyOS应用开发的支持与优化
Compiler-dev IDE Support and
Optimization for the HormonyOS Application Development on the RISC-V
Architecture
|
王锋,湖南卡姆派乐信息科技有限公司CEO
Feng
Wang, CEO, Hunan Compiler Information Technology Co. Ltd.
|
17:50-17:55
|
幸运抽奖Lucky
Draw
|
2021年12月23日,星期三
Dec. 23, Wednesday, 2021
专题论坛(三)
Subject Forum (III)
地点:无锡君来世尊酒店一楼兰花厅A
Venue: Lan Ballroom A, 1F, Worldhotel Grand Juna Wuxi
时 间
Time
|
内 容
Contents
|
演讲人
Lecturer
|
先进封装与测试(一)
Advanced Packaging and Testing
(I)
|
主持人:周荣,中国半导体行业协会集成电路设计分会副秘书长
Moderator: Rong Zhou, Vice
General Secretary, CSIA-ICCAD
|
08:40-09:00
|
“芯片-封装-系统”协同设计及其价值体现
Unleash
the Value with Silicon-Packaging-System Co-Design
|
杨程,长电科技设计服务事业部先进及系统级封装设计总监
Cheng
Yang, Director of Advanced Packaging and SiP Design, Design Service BU, JCET
Group
|
09:00-09:20
|
一个先进的半导体测试开发流程
An
Advanced IC Test Development Flow
|
赵庆,摩尔精英产品工程副总裁
Qing Zhao, VP of Product Engineering, MooreElite
|
09:20-09:40
|
先进封装中关于晶圆划片的几项技术应用
Several
Technical Applications of Wafer Dicing in Advanced Packaging
|
余胡平,沈阳和研科技有限公司副总经理
Huping
Yu, GM, Shenyang Heyan Technology Co., Ltd.
|
09:40-10:00
|
逆向工程是否能加速中国“芯”的发展
Can
Reverse Engineering Accelerate the Development of Chinese Cores?
|
贾丽娟,上海聚跃检测技术有限公司技术总监
Lisa Jia, Technical
Director, Juyue Inspection Technology Co., Ltd.
|
10:00-10:20
|
封装集成技术趋势与解决方案
Package
Challenges On SiP & FHEC' Solutions
|
钟磊,甬矽电子(宁波)股份有限公司, 研发总监
Zhong Lei,
R&D Director, Forehope Electronic(NING BO) Co. Ltd.
|
10:20-10:40
|
车用电子封装趋势与解决方案
Technology
Trend & Package Solution for Automotive Application
|
沈政昌,日月光集团汽车工程处处长
Allen Shen,
Director of Automotive Engineering Division, ASE Group
|
10:40-11:00
|
高性能环氧塑封料解决方案
High
Performance Epoxy Molding Compound Solution
|
王善学,江苏科化新材料科技有限公司副总经理
Shanxue
Wang, Dupty Gerneral Manager, Jiangsu KEHUA New Materials
Technology Co., Ltd.
|
11:00-11:20
|
基板扇出型封装工艺的应用和挑战
Application
and Challenge of Base Plate Fan-out Packaging Process
|
谭小春,合肥矽迈微电子科技有限公司总经理
Xiaochun Tan, GM, Hefei SMAT Microelectronics Technology Co.,
Ltd.
|
11:20-11:40
|
奈米探针在芯片电性上的应用
The
Application of Nano-probe in IC Electric Failure Analysis
|
陈志荣,蔚思博检测技术(合肥)有限公司工程处协理
Phil
Chen, Director, VESP Technology Corp.
|
11:40-12:00
|
拥抱新工艺测试挑战,加速中国数“质”变革
Embracing
New Test Technology Challenges Speed up China Digital Evolution
|
于波,泰瑞达(上海)有限公司现场产品专家
Beck
Yu, Field Product Specialist, Teradyne
(Shanghai) Co., Ltd.
|
12:00-12:05
|
幸运抽奖Lucky
Draw
|
12:05-13:10
|
自助午餐Buffet
Lunch
|
主持人:徐秀法,中国半导体行业协会集成电路设计分会副秘书长
Moderator: Xiufa Xu, Vice General
Secretary, CSIA-ICCAD
|
13:10-13:30
|
池州华宇电子探索SiP集成封测解决方案
HISEMI
Integration Solutions for SiP Packaging and Testing
|
彭勇,池州华宇电子科技股份有限公司总经理
Peter
Peng, GM, Chizhou HISEMI Electronics Technology Co., Ltd.
|
13:30-13:50
|
数据信息时代射频器件封装技术发展
Development
of RF Device Packaging Technology in the Era of Data and Information
|
刘卫东,华天科技技术市场总监
Wade
Liu, Technical & Marketing Director, HT-Tech
|
13:50-14:10
|
多端口射频前端与变频器件的测试方案
Measurement
Solution for FEM and Frequency Converting Devices
|
荀飞,罗德与施瓦茨矢量网络分析仪产品经理
Ivan Xun, R&S VNA PM, Beijing Rohde & Schwarz
Communication Technology Co., Ltd.
|
14:10-14:30
|
后摩尔时代关键封装技术分析
Key Package
Assembly Technology Analysis for Post - Moore’s Law
Era
|
王鹏,通富微电业务中心技术行销副总 Peng Wang, VP of TPM, TFME
|
14:30-14:50
|
数字仿真与工艺结合应用
Combined
Application of Digital Simulation and Technology
|
巫文豪,上海哥瑞利软件有限公司产品中心总监
Wenhao
Wu, Product Center Director, Shanghai Glorysoft Co., Ltd.
|
14:50-15:10
|
移动时代---超薄集成电路面临的机遇与挑战
Opportunities
and Challenges for Ultra-thin Integrated Circuits in the Mobile Era
|
何忠亮,深圳市鼎华芯泰科技有限公司董事长
He
Zhong Liang, Chairman, Shenzhen Ding Waa Sam Tai Technology Co., Ltd.
|
15:10-15:30
|
新一代数字SOC测试
Next Generation Digital SOC Test
|
葛樑,爱德万测试(中国)业务发展高级经理
Liang
Ge, Senior Business Development Manager, Advantest China
|
15:30-15:50
|
先进失效分析技术在集成电路的应用
Application
of Advanced Failure Analysis Skill in Integrated Circuits
|
陈清珑,苏试宜特检测技术有限公司失效工程处处长
Larry
Chen, Division Manager, CHINAiSTI Testing Technology Co., Ltd.
|
15:50-16:10
|
得“芯”应手,是德科技高性能芯片测试之道
From
Chipset to Cloud, Keysight helps on high performance IC test
|
阳任平,是德科技中国区IC行业经理
Renping
Yang, Greater China IC Industry Manager, Keysight
|
16:10-16:30
|
晶圆级扇出封装技术
Wafer Level Fan-out Packaging Technology
|
吕书臣,江苏中科智芯集成科技有限公司销售市场总监
Shuchen Lv, Sales & Marketing Director, CASMEIT
|
16:30-16:50
|
国产高端芯片封测的发展机遇--锐杰微科技的产品与服务介绍
Development
Opportunities of Domestic High-end Chip Packaging and Testing-Introduction of
Products and Services of RMT
|
方家恩,锐杰微科技集团董事长
Jiaen
Fang, Chairman of the Board, Rigger Micro Technologies
|
16:50-17:10
|
ATE测试接口PCB设计与制造所面临的挑战和机会
Challenges
and Opportunities in the Design and Manufacture of ATE Test Interface Board
|
周德祥,天芯互联科技有限公司产品线总监
Russell Zhou, Product Director, Sky Chip Interconnect
Technology Co., Ltd.
|
17:10-17:30
|
有机载板在模块化和异构集成发展路线上的重要性
The
Importance of Organic Substrates for Modularization and Heterogeneous
Integration
|
贝罗莎,奥特斯(中国)有限公司事业部半导体业务部高级总监
Rozalia
Beica, Business Line Semiconductors, AT&S BU MS
|
17:30-17: 50
|
先进封测技术在5G产品中的应用
The
Application of Advanced Package and Testing Technology in 5G Products
|
孙拓北,深圳市中兴微电子技术有限公司封测量产部部长
Tuobei Sun, Director, Shenzhen Sanechips
Technology Co., Ltd.
|
17:50-17:55
|
幸运抽奖Lucky
Draw
|
2021年12月23日,星期三
Dec. 23, Wednesday, 2021
专题论坛(四)
Subject Forum (IV)
地点:无锡君来世尊酒店一楼兰花厅B
Venue: Lan Ballroom B, 1F, Worldhotel Grand Juna Wuxi
时 间
Time
|
内 容
Contents
|
演讲人
Lecturer
|
无锡集成电路产业创新发展高峰论坛暨第三届太湖创芯峰会
|
主持人:王伟伦,无锡市滨湖区人民政府副区长
|
08:30-09:00
|
嘉宾签到
|
09:00-09:15
|
无锡市人民政府领导致辞
|
中国半导体行业协会集成电路设计分会理事长致辞
|
中国电子信息产业发展研究院领导致辞
|
09:15-09:30
|
滨湖区集成电路产业介绍推介
|
09:30-10:30
|
启动仪式:无锡集成电路产业学院启动仪式
· 签约仪式
1、校地合作签约:
2、院地合作签约:
3、基地合作签约:
4、近期落户产业项目签约:扬杰科技、神州龙芯、惠芯、易矽(蠡园开发区领导与企业代表共同签约)
5、深化产业合作项目签约
|
10:30-11:00
|
集成电路设计业代表企业演讲
|
11:00-11:30
|
专家高峰圆桌讨论:设计先行 创芯无限
主持人:江苏省半导体行业协会秘书长 秦舒
|
11:30-11:35
|
幸运抽奖Lucky
Draw
|
11:35-13:10
|
自助午餐Buffet
Lunch
|
资本与IC设计业
VC and IC Design Industry
|
主持人:孙坚,石溪资本管理合伙人、中国半导体行业协会集成电路设计分会副秘书长
Moderator: Jian Sun, Vice
General Secretary, CSIA-ICCAD
|
13:10-13:30
|
下一波——半导体行业新阶段
Next wave - IC Industry New Era
|
王林,华登国际合伙人
Wang Lin, Partner of Walden International
|
13:30-13:50
|
助力中国半导体产业2.0时代
Assist
China's Semiconductor Industry 2.0
|
王蓓蓓,中芯聚源股权投资管理(上海)有限公司董事总经理
Beibei Wang, Managing Director, China
Fortune-tech Capital Co., Ltd.
|
13:50-14:10
|
赋能半导体产品创新
Enabling Semiconductor Product Innovation
|
胡颖平,元禾璞华董事总经理
Yingping
Hu, Managing Director, Hua Capital
|
14:10-14:30
|
半导体热潮下中国半导体发展和投资机遇
Semiconductor
Development and Investment Opportunities in China under the Semiconductor
Upsurge
|
苏仁宏,湖杉资本创始合伙人
Tony Su,
Founding Partner CEO, Allin Capital
|
14:30-14:50
|
产投联动,芯创未来一一中关村芯创基金与ICPARK园区的共生实践
Industry-Investment
Linkage, Chip Innovation Future, the Symbiotic Practice of ZhongGuanCun
XinChuang Fund and ICPARK
|
许正文,北京中关村集成电路设计园发展有限责任公司执行总经理
ZhengWen Xu, Executive GM, Zhongguancun
Intergrated Circuit Design Park
|
先进封装与测试(二)
Advanced Packaging and Testing
(II)
|
14:50-15:10
|
多芯片3D合封晶圆级集成封装技术- SmartPoserTM
SmartPoserTM for Multi-chip 3DIC Integration
|
林正忠,盛合晶微半导体(江阴)有限公司VP副总裁
ChengChung Lin, VP, SJ Semiconductor (JiangYin) Corp.
|
15:10-15:30
|
车规级电子元器件可靠性解决方案——AECQ
Reliability
Solution of Vehicle Specification Level Electronic Components——AECQ
|
杜润,苏州华碧微科检测技术有限公司技术经理
Mark Du, Technical Manager, Suzhou FALAB Test Technology Co.,
Ltd.
|
15:30-15:50
|
Labless的前世今生——芯片医院与高端制造业变革
Labless
- Past Present & Future
|
李晓旻,胜科纳米(苏州)有限公司总裁/董事长
Xiaomin
Li, President and Chairman, Wintech-Nano (Suzhou) Co., Ltd.
|
15:50-16:10
|
在WLP/PLP量产型贴片机选择中的重要考虑因素
Important Considerations of Selecting WLP & PLP Die PnP
Tool For HVM
|
张迪,ASM太平洋科技有限公司
Derek Zhang, Business Development Manager,
ASM Pacific Technology Ltd.
|
16:10-16:30
|
功率器件中UBM层-化学镀的实际运用
Application
of Electroless Plating for Power Devices
|
黄雷,深圳市创智成功科技有限公司总经理
Lei
Huang, GM, Shenzhen Chuangzhi Success Technology Co., Ltd.
|
16:30-16:50
|
基于TSV工艺的先进封装技术
TSV
Based Advanced Packaging Technology
|
周鸣昊,华进半导体封装先导技术研发中心有限公司市场总监
MingHao Zhou, Marketing Director, National Center for
Advanced Packaging Co., Ltd.
|
16:50-17:10
|
异构封装在AI 和超级计算中的应用
Heterogeneous IC Packaging for AI and Compute
|
王明波,安靠科技大中华区销售和市场副总监
Bibby Wang, Deputy Director of Greater China Sales & Marketing,
Amkor Technology, Inc.
|
17:10-17:30
|
先进封装缺陷及失效案例解析
Advanced Packaging Defect and Failure Analysis Cases
|
高峰,闳康技术检测(上海)有限公司
FA工程部门经理
Otis
Gao, FA Department Manager, Materials
Analysis Technology (Shanghai) Ltd.
|
17:30-17: 50
|
ATE为你实现出色的多媒体音频/视频应用
Enabling
Multimedia-Oriented ATE Test System
|
陈文建, CHROMA中茂电子(上海)有限公司资深销售经理
Wen
Chien Chen, Senior Sales Manager, Chroma Electronics (Shanghai) Co., Ltd.
|
17:50-17:55
|
幸运抽奖Lucky
Draw
|
2021年12月23日,星期三
Dec. 23, Wednesday, 2021
专题论坛(五)
Subject
Forum (V)
地点:无锡君来世尊酒店二楼8号会议室
Venue: Meeting Room 8, 1F, Worldhotel Grand Juna Wuxi
时 间
Time
|
内 容
Contents
|
演讲人
Lecturer
|
EDA与IC设计创新
EDA and IC Design Innovation
|
主持人:沈磊,中国半导体行业协会集成电路设计分会副理事长
Moderator: Lei Shen, Vice General
Director, CSIA-ICCAD
|
08:40-09:00
|
Cadence面向三维芯片设计规划、实现和系统级仿真的集成化解决方案
Cadence 3D-IC Multi-die Integrated Solution for 3D Design
Planning, Implementation and System Level Analysis
|
邓立群,Cadence数字集成电路自动化设计研发中心产品工程总监
Richie Deng, Product Engineering Director of Digital &
Signoff Group, Cadence
|
09:00-09:20
|
西门子EDA如何协助开发智能汽车芯片
Siemens EDA Solutions for Smart Vehicle IC Design
|
李立基,西门子EDA亚太区技术总监
Lincoln Lee, Technical Director, PacRim, Siemens EDA
|
09:20-09:40
|
数字异构验证助力先进节点集成电路设计
Benefits of Heterogeneous Verification
|
陈正坚,上海国微思尔芯技术股份有限公司资深技术市场总监
Ken Chen, Senior Director of Technical Marketing Department
|
09:40-10:00
|
汽车功能安全性
Automotive Functional Safety
|
周磊,新思科技汽车电子功能安全性验证资深AE工程师
Lane.Zhou, Automotive Functional Safety Staff AE, Synopsys
|
10:00-10:20
|
打造模拟芯片设计制造协同发展生态
Constructing the Design-Technology Ecosystem for Analog
Circuit Development
|
刘晓明,华大九天产品总监
Liu Xiaoming, Product Director, Empyrean Technology Co.,
Ltd.
|
10:20-10:40
|
蓄力向前,打造面向存储的全流程EDA
Landing DTCO to Accelerate Memory EDA Solutions
|
李严峰,上海概伦电子股份有限公司执行副总裁
Yanfeng Li, EVP, Primarius Technologies Co., Ltd.
|
10:40-11:00
|
打通数字验证全流程,引领新一代EDA (draft)
Breakthrough Digital Verification Solution for Next
Generation of EDA(draft)
|
黄武,芯华章科技产品市场总监
David Hwang, Product Marketing Director, X-EPIC
|
11:00-11:20
|
EDA 上云——加速中国“芯”时代
Accelerate Cloud Transformation - EDA on Azure
|
孙海亮,微软行业解决方案部总经理
Heidi Sun, Industry Solution Director, Microsoft
|
11:20-11:40
|
2.5D/3D 异构集成跨尺度联合仿真解决方案
2.5D/3D Heterogeneous Integrated Cross-Scale Co-Simulation
|
苏周祥,芯和半导体高级技术支持总监
Zachary Su, AE Director, Xpeedic Technology
|
11:40-12:00
|
汽车芯片多物理场电源完整性可靠性分析
Multiphysics Power Noise and Reliability Signoff for
Automotive Applications
|
崔硕岳,Ansys公司半导体事业部技术经理
Shuoyue Cui, Manager Application Engineering, Ansys
|
12:00-12:05
|
幸运抽奖 Lucky Draw
|
12:05-13:10
|
自助午餐Buffet
Lunch
|
主持人:刘娜,中国半导体行业协会集成电路设计分会副秘书长
Moderator: Na Liu, Vice General
Secretary, CSIA-ICCAD
|
13:10-13:30
|
面向大规模SoC验证的EDA IaaS解决方案
An EDA IaaS Solution to Face SoC Verification Challenges
|
马超,英诺达(成都)电子科技有限公司市场及业务拓展部副总裁
Chao Ma, VP of MBD, EnnoCAD Electronic
Technology Co., Ltd.
|
13:30-13:50
|
业界独特的版图寄生参数分析工具Viso
Viso: An Unique Parasitic Exploration Tool for Layout Design
|
刘客,Silvaco中国AE经理
Ke Liu, AE Manager, Silvaco
China., Ltd.
|
13:50-14:10
|
下一代EDA技术
Next generation technology of EDA
|
陈岚,中科芯云微电子科技有限公司董事长
Lan Chen, Chairman, Chip Cloud
Microelectronics Technology Co., Ltd.
|
14:10-14:30
|
与芯同行,行芯Signoff工具链加速先进工艺设计收敛
Follow with IC Design, Phlexing EDA
Tools Accelerate Signoff Closure at Advanced Nodes
|
贺青,杭州行芯科技有限公司CEO
Qing He, CEO, Hangzhou Phlexing
Technology Co., Ltd.
|
14:30-14:50
|
云端半导体协同创新
Semiconductor Collaborative
Innovation on Cloud
|
周宇,亚马逊云科技高科技行业拓展总监
Kevin Zhou, Director of Industry
Business Development, High-Tech., Amazon Web Services
|
14:50-15:10
|
大规模集成光电子设计关键技术
Key Technologies for Large-scale Photonic
Integrated Circuits (PICs) Design
|
郭进,联合微电子中心(CUMEC)副总经理
Jin Guo, VP, United Microelectronics
Center
|
15:10-15:30
|
EDA弹性云计算方案
EDA Elastic Calculation
on Cloud
|
王汉杰,摩尔精英IT/CAD设计平台服务副总裁
Johnny Wang, VP of IT/CAD
Design Platform Service, MooreElite
|
15:30-15:50
|
集成电路设计工艺协同优化完整方案:流程、EDA软件、自动化
A Holistic Approach to DTCO:
work flow, EDA tools, and automation
|
伍宏,墨研计算科学(南京)有限公司总经理
Hong Wu, CEO, Moyan Computational Science (Nanjing) Co., Ltd.
|
15:50-16:10
|
智能数据+平台帮助芯片设计企业精准触达目标用户,助力国产替代
Intelligent Data + Platform Helps Chip Design Enterprises Accurately
Reach Target Users and Help Domestic Alternatives
|
王新,Supplyframe四方维市场总监
Shane
Wang, Marketing Director, Suppyframe
|
16:10-16:30
|
智能云加速IC设计
Intelligent Cloud Accelerates IC Design
|
邓世友,紫光云技术有限公司 CTO办公室主任
Shiyou Deng, Director UniCloud CTO Office, UNICLOUD TECH CO.,
LTD
|
16:30-16:50
|
Altair高性能计算驱动EDA流程优化高速提效
Altair High-performance Computing Drives
EDA Process to High Speed Optimize and Efficiency
|
王轶华,Altair企业计算部技术经理
Yihua Wang, Enterprise Computing
Technical Manager, Altair
|
16:50-17:10
|
IC设计企业如何系统性大幅提升研发效率——面向EDA行业应用的一站式IC设计研发云平台
How Could IC Design Companies Significantly Improve R&D Efficiency
Systematically-a One-Stop IC Design R&D Cloud Platform
|
陈琳涛,上海速石信息科技有限公司高级技术总监
Leo Chen, Senior Director, Shanghai FASTONE Information
Technology Co., Ltd.
|
17:10-17:30
|
IoT时代的超低功耗蓝牙模块设计
The Discussion of an Ultra-low Power BLE5 Module for IoT
Application
|
冯琪,苏州芯联成软件有限公司电路工程处经理
Qi Feng, Head of IC Analysis Department, Suzhou Silintech
Company
|
17:30-17:50
|
良率驱动的芯片制造全流程解决方案
Yield Driven Chip Manufacturability Solutions
|
俞宗强,东方晶源微电子科技(北京)有限公司董事长及联合创始人
Zongchang Yu, Chairman of the Board, and Co-founder, Dongfang
Jingyuan Electron Limited
|
17:50-17:55
|
幸运抽奖Lucky
Draw
|
2021年12月23日,星期三
Dec. 23, Wednesday, 2021
专题论坛(六)
Subject Forum (VI)
地点:无锡君来世尊酒店二楼12号会议室
Venue: Meeting Room 12, 1F, Worldhotel Grand Juna Wuxi
时 间
Time
|
内 容
Contents
|
演讲人
Lecturer
|
FOUNDRY与工艺技术
Foundry and Process Technology
|
主持人:张力天,中国半导体行业协会集成电路设计分会副理事长
Moderator: Litian Zhang, Vice
General Director, CSIA-ICCAD
|
08:40-09:00
|
TSMC 的先进逻辑工艺和3D 集成技术
TSMC’s Leadership in Advanced Logic
and 3D Integration Technology
|
蔡玥,台积电中国区业务发展副总监
Amy Cai, China Business Development
Deputy Director, TSMC
|
09:00-09:20
|
联电先进特色工艺
UMC Advanced
Specialty Technologies
|
陈剑波,和舰芯片制造(苏州)股份有限公司销售经理
Snowwolf
Chen, Sales Manager, HeJian Technology (Suzhou) Co., Ltd.
|
09:20-09:40
|
先进特色工艺智联未来
Advanced
Specialty Technologies Shape the Future
|
田明,上海华力微电子有限公司研发总监
Ming
Tian, Senior Director of TD, HLMC
|
09:40-10:00
|
从电子到光子
From Electron to Photon
|
朱宇,格芯中国区业务发展总监
Fisher
Zhu, Director of China Business Development, GlobalFoundries
|
10:00-10:20
|
深耕特色工艺,打造“晶圆+”模式
Deeply Develop Characteristic Technology, to Create Foundry Plus Mode
|
王霄,华润微电子代工事业群市场与销售中心高级总监
Xiao
Wang, Senior Director of Marketing & Sales Center,
Foundry
Business Group, CR Micro
|
10:20-10:40
|
3D传感感知世界
3D Imager
Sensing the World
|
方大晟,Tower
Semiconductor中国区销售总监
Dasheng,
China Sales Director, Tower
Semiconductor Ltd.
|
10:40-11:00
|
国产IP助力以数据为中心的计算架构创新
Domestic IPs
Power Data-centric Computing Architecture Innovation
|
王晓阳,上海奎芯集成电路设计有限公司副总裁
Sean Wang, VP, MSQUARE
Ltd. Shanghai
|
11:00-11:20
|
同“芯”共赢,助力汽车电子“芯”生态
Win-win Cooperation on Chips to Help Create
Chip Ecosystem of Automotive Electronics
|
杨继业,上海华虹宏力半导体制造有限公司总监
Jiye Yang, Senior Director, ShangHai
Huahong Grace Semiconductor Manufacturing Corporation
|
11:20-11:40
|
全球领先研究中心,助力半导体创新
The World’s
Leading Research Center Boost Semiconductor Innovation
|
蔡立达,欧洲微电子研究中心现场应用经理
Lida Cai, FAE
Manager, IMEC
|
11:40-12:00
|
异构集成解锁芯片潜力
Heterogeneous
Integration Stimulates IC Potential
|
唐伟炜,摩尔精英封装服务副总裁
Sunny
Tang, VP of Assembly Services, MooreElite
|
12:00-12:05
|
幸运抽奖Lucky
Draw
|
12:05-13:10
|
自助午餐 Buffet Lunch
|
IC设计与应用
IC Design & Application
|
主持人:樊晓华,中国半导体行业协会集成电路设计分会副秘书长
Moderator: Xiaohua Fan, Vice
General Director, CSIA-ICCAD
|
13:10-13:30
|
R16芯片-5G新征程,工业物联新起点
R16 ready, a new chapter in 5G+IIoT
|
汪大海,紫光展锐产品规划总监
Alexander Wang, Marketing Director, UNISOC
|
13:30-13:50
|
基于NOR Flash技术的人工智能终端推理芯片
A NOR Flash Based Inference IC for Low-Power Edge Devices
|
吕向东,恒烁半导体(合肥)股份有限公司董事长
Xiangdong Lu, CEO, Zbit Semiconductor, Inc.
|
13:50-14:10
|
高性能GPU的应用及架构特点
Applications
and Architecture Features of High Performance GPU
|
付轩,沐曦集成电路(上海)有限公司架构师
Gary
Fu, Architect, MetaX Integrated Circuits (Shanghai) Co., Ltd.
|
14:10-14:30
|
国家集成电路芯火平台的探索
Exploration
of National Xinhuo Innovation Base(Paltform)
|
吕会军,南京集成电路产业服务中心(ICisC)副总经理
Huijun
Lv, Deputy GM, Nanjing IC Industry Service Center Co., Ltd.
|
14:30-14:50
|
HC9001第五代PCIe高端存储控制芯片
HC9001
PCIe Gen5 Nand Flash Controller Chip
|
庄健民,江苏华存电子科技有限公司副总经理
Marco
Chuang, VGM, Jiangsu Huacun Electronic Technology Co., Ltd.
|
14:50-15:10
|
高性能可重构网络安全芯片
High-performance
Reconfigurable Network Adaptor Chip
|
朱敏,无锡沐创集成电路设计有限公司CEO
Min
Zhu, CEO, Wuxi Micro Innovation Integrated Circuit Design Co., Ltd.
|
15:10-15:30
|
WTM2101:
存算一体芯片
WTM2101:
Computing-in-memory SoC
|
王绍迪,北京知存科技有限公司CEO
Shaodi Wang, CEO, Beijing Zhicun (WITIN) Technology Co., Ltd.
|
15:30-15:50
|
高性能可重构GP-GPU芯片——RPP R8
High
performance reconfigurable GP - GPU(RPP R8)
|
李原,珠海市芯动力科技有限公司CEO
Yuan Li, CEO, Zhuhai Azurengine Technology Co., LTD.
|
15:50-16:10
|
蓝牙低功耗(BLE)技术特点及其应用发展趋势
Technical
Features and Application Trends in Bluetooth Low
Energy (BLE)
|
张书迁,北京昂瑞微电子技术有限公司市场部高级总监
Shuqian
Zhang, Senior Marketing Director, Beijing OnMicro Electronics Co., Ltd.
|
16:10-16:30
|
存储核芯拓展新兴领域
The
Advanced Memory in New Emerging Marketing
|
田玥,北京兆易创新科技股份有限公司存储事业部市场经理
Yue Tian, Marketing Manager, GigaDevice Semiconductor (Beijing) InC
|
16:30-16:50
|
新数据中心网络中的芯方案
Chip
Solution in New Data Center Network
|
陈永洲,烽火通信科技股份有限公司 技术专家
Yongzhou Chen, Technician, FiberHome Telecommunication
Technologies, Co., Ltd.
|
16:50-17:10
|
方寸用芯片构建网络空间安全基石
TIH Building the Cornerstone of
Cyberspace Security with Chip
|
叶智辉,山东方寸微电子科技有限公司执行副总裁
Jason Ye, EVP, TIH Microelectronics
Co., Ltd.
|
17:10-17:30
|
高性能自动驾驶芯片赋能汽车智能化转型
High-performance
AD Chip Enabling Intelligent Transformation of Automobile
|
王治中,黑芝麻智能科技产品市场总监
Daniel Wang, Product Marketing
Director, Black Sesame Technologies (Shanghai) Co., Ltd.
|
17:30-17:50
|
AI计算:从物理感知到知识聚合
AI
Computing: From Physical Perception to Knowledge Consolidation
|
徐宁仪,上海阵量智能科技有限公司CEO
Michael
Xu, CEO, ShangHai PowerTensors Intelligent Technology Co., Ltd.
|
17:50-17:55
|
幸运抽奖Lucky
Draw
|
日程以最终现场公布为准Agenda
up to final site release
|