5G集成电路的挑战

IC Challenges for 5G

  演讲人：

刘大可

国家专家，国家千人计划特聘教授

北京理工大学专用处理器研究所所长

Dake Liu

Professorassigned by the China Recruitment

                   Program of Global Experts (1000-plan)

                   Director of ASIP Lab, Beijing Institute of Technology

演讲人简历：

刘大可是瑞典林雪平大学计算机结构学科终身教授。中国国家特聘专家，中组部国家千人计划特聘教授，北理工专用处理器研究所所长，新思科技和北理工专用处理器联合实验室主任。主要研究通信集成电路，包括无线基带专用处理器，实时网络处理器，医疗微小植入系统。

Dr. Dake Liu is the chair professor for Computer engineering of Linköping University, Sweden. He is the state expert of China, professor assigned by China recruitment of global expert (1000 plan). He is currently the director of ASIP (Application Specific Instruction-set Processor) Lab (co-lab with Synopsys), Beijing Institute of Technology. He spun off Coresonic Sweden acquired by MTK and FreehandDSP Sweden acquired by VIA. His research interests are ASIP for SDR, communication systems, and medical micro systems.

报告摘要：

第五代移动通信技术5G提供超高传输带宽、超低通信延迟、更高的频谱利用效率以及更灵活的接入方式。同时对硬件实现提出了及其严酷的挑战。在算法层面，研究人员和设备商已投入大量的研究。然而，在集成电路的实施层面却鲜有研究。虽有少量的FPGA子电路的探索，但不足以全面的了解面临的挑战。超密组网UDN将是通信设备领域下一个经济增长点，但是其硬件开销并不清晰。文报告将试图综述5G集成电路的挑战，供设备商、半导体系统商、和科研人员参考。

5G mobile communication system offers ultrahigh bandwidth, low latency, and higher spectrum efficiency as well flexible accesses.

At the same time the hardware implementation will be a great challenge. There have been much research on system algorithm level. However, there is so far no research on IC implementation. Available FPGA based kernel circuits cannot expose sufficient system design challenges. UND will be the next growth point for OEMs. The knowledge on the related hardware cost is thus essential. The seminar will expose IC related challenges for OEMs, semiconductors, and researches.